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    High-Cleanliness Vacuum Soldering System with Low Void & Flux-Free Capability — H6
    • High-Cleanliness Vacuum Soldering System with Low Void & Flux-Free Capability — H6

    High-Cleanliness Vacuum Soldering System with Low Void & Flux-Free Capability — H6

    Observation System The chamber is equipped with a viewing window for real-time observation of the soldering process. Heating System The system is configured with 6 independent heating modules (H6) that operate simultaneously in a vacuum environment. Vacuum System Equipped with a large-scale vacuum pump to rapidly achieve a vacuum level below 10 Pa in the furnace chamber.
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    Observation System


    The chamber is equipped with a viewing window for real-time observation of the soldering process.


    Heating System


    The system is configured with 6 independent heating modules (H6) that operate simultaneously in a vacuum environment.


    Vacuum System


    Equipped with a large-scale vacuum pump to rapidly achieve a vacuum level below 10 Pa in the furnace chamber.


    Cooling System


    Adopts a water cooling system to ensure rapid cooling even under high-temperature vacuum conditions.


    Software System


    Programmable temperature ramp-up and ramp-down control, allowing users to set customized thermal profiles. Each profile can be automatically generated, edited, modified, and stored.


    Control System


    Modular software design enables independent configuration of process profiles, vacuum pumping, atmosphere control, and cooling cycles. These processes can be combined for one-click automated production.


    Atmosphere System


    Supports flux-free soldering and can be filled with reductive or protective gases such as N₂/H₂ mixture, HCOOH (formic acid), and N₂, ensuring a solder joint void ratio of less than 1%. The hydrogen (H₂) function is optional.


    Data Logging System


    Features uninterrupted real-time monitoring and data recording, including software profile logging, temperature control curve storage, process parameter saving, equipment parameter recording, and profile retrieval.


    Safety Protection System


    Integrates 8 safety monitoring and protection functions:


    • Workpiece over-temperature protection
    • Overall equipment temperature safety protection
    • Low/high air pressure alarm
    • Water pressure protection
    • Safe operation protection
    • Cooling water circuit protection during soldering
    • Liquid level protection
    • Power failure protection



    Application Fields


    IGBT modules, MEMS packaging, LED packaging, automotive lighting, high-power semiconductor devices, optoelectronic device packaging, hermetic packaging, microwave device packaging, and microelectronic production lines for various products.



    Key Technical Parameters


    A. Vacuum Level: ≤ 10 Pa, with real-time display and programmable control/regulation of chamber vacuum.


    B. Vacuum Pumping Speed: 50 m³/h


    C. Process Chamber Pressure Range: 10–1000 Pa


    D. Heating Plate Layer Load Capacity: ≥ 20 kg per layer


    E. Rapid Cooling Rate: Independent water and gas cooling units in the chamber enable fast cooling of welded components.


    F. Low Void Soldering Quality: Ensures a void ratio of less than 1% on large-area pads after soldering.


    G. Solder Compatibility: Suitable for high-quality soldering in high-temperature and vacuum environments with materials such as AuSn solder foils, high-lead solders, and lead-free solder pastes.


    H. High Productivity: Each layer offers an effective soldering area of 500 × 300 mm, with multi-layer simultaneous operation enabling mass production of devices. 



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    High-Cleanliness Vacuum Soldering System with Low Void & Flux-Free Capability — H3

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    • High-Cleanliness Vacuum Soldering System with Low Void & Flux-Free Capability — H6


    • Observation System


      The chamber is equipped with a viewing window for real-time observation of the soldering process.


      Heating System


      The system is configured with 6 independent heating modules (H6) that operate simultaneously in a vacuum environment.


      Vacuum System


      Equipped with a large-scale vacuum pump to rapidly achieve a vacuum level below 10 Pa in the furnace chamber.


      Cooling System


      Adopts a water cooling system to ensure rapid cooling even under high-temperature vacuum conditions.


      Software System


      Programmable temperature ramp-up and ramp-down control, allowing users to set customized thermal profiles. Each profile can be automatically generated, edited, modified, and stored.


      Control System


      Modular software design enables independent configuration of process profiles, vacuum pumping, atmosphere control, and cooling cycles. These processes can be combined for one-click automated production.


      Atmosphere System


      Supports flux-free soldering and can be filled with reductive or protective gases such as N₂/H₂ mixture, HCOOH (formic acid), and N₂, ensuring a solder joint void ratio of less than 1%. The hydrogen (H₂) function is optional.


      Data Logging System


      Features uninterrupted real-time monitoring and data recording, including software profile logging, temperature control curve storage, process parameter saving, equipment parameter recording, and profile retrieval.


      Safety Protection System


      Integrates 8 safety monitoring and protection functions:


      • Workpiece over-temperature protection
      • Overall equipment temperature safety protection
      • Low/high air pressure alarm
      • Water pressure protection
      • Safe operation protection
      • Cooling water circuit protection during soldering
      • Liquid level protection
      • Power failure protection



      Application Fields


      IGBT modules, MEMS packaging, LED packaging, automotive lighting, high-power semiconductor devices, optoelectronic device packaging, hermetic packaging, microwave device packaging, and microelectronic production lines for various products.



      Key Technical Parameters


      A. Vacuum Level: ≤ 10 Pa, with real-time display and programmable control/regulation of chamber vacuum.


      B. Vacuum Pumping Speed: 50 m³/h


      C. Process Chamber Pressure Range: 10–1000 Pa


      D. Heating Plate Layer Load Capacity: ≥ 20 kg per layer


      E. Rapid Cooling Rate: Independent water and gas cooling units in the chamber enable fast cooling of welded components.


      F. Low Void Soldering Quality: Ensures a void ratio of less than 1% on large-area pads after soldering.


      G. Solder Compatibility: Suitable for high-quality soldering in high-temperature and vacuum environments with materials such as AuSn solder foils, high-lead solders, and lead-free solder pastes.


      H. High Productivity: Each layer offers an effective soldering area of 500 × 300 mm, with multi-layer simultaneous operation enabling mass production of devices. 



    Inline Formic Acid High-Vacuum Sintering Furnace — VX610

    Inline Formic Acid High-Vacuum Sintering Furnace — VX610

    The furnace consists of 5 zones: Loading Zone, Preheating Zone, Heating Zone, Cooling Zone and Unloading Zone. It is configured with a double-layer vacuum chamber (internal and external), a distinctive design compared with the single-layer vacuum chambers of similar equipment. This double-layer structure ensures zero workpiece oxidation and formic acid leakage prevention, with the oxygen content maintained below 5 ppm.
    Inline Formic Acid High-Vacuum Sintering Furnace — VX410

    Inline Formic Acid High-Vacuum Sintering Furnace — VX410

    The furnace consists of 5 zones: Loading Zone, Preheating Zone, Heating Zone, Cooling Zone and Unloading Zone. It is configured with a double-layer vacuum chamber (internal and external), a distinctive design compared with single-layer vacuum chambers of similar equipment. The double-layer structure ensures zero workpiece oxidation and formic acid leakage prevention, with the oxygen content maintained below 5 ppm.
    Inline Formic Acid Vacuum Sintering Furnace — VF300

    Inline Formic Acid Vacuum Sintering Furnace — VF300

    The furnace consists of 3 independent process chambers for Preheating, Heating and Cooling respectively; each chamber is fitted with a viewing window, and the pressure of the process chamber ranges from 0.2 to 1050 mbar. The furnace supports and enables precise control of nitrogen, formic acid (nitrogen + formic acid) atmospheres, and is compatible with preformed solder foil processes. Programmable multi-stage vacuum pumping function: Each chamber is equipped with an independent vacuum pump and control system, with a vacuum level ≤ 1 mbar and a pumping speed of 100 m³/h. A soft pumping valve is installed for adjustable pumping rate. The vacuum value of the chamber is displayed in real time and can be controlled and adjusted.
    Inline Formic Acid Vacuum Sintering Furnace — VF400

    Inline Formic Acid Vacuum Sintering Furnace — VF400

    The furnace consists of 4 independent process chambers: 2 Preheating Zones, 1 Heating Zone and 1 Cooling Zone; each chamber is fitted with a viewing window, and the pressure of the process chamber ranges from 20 to 200 Pa. The furnace supports and enables precise control of nitrogen, formic acid (nitrogen + formic acid) atmospheres, and is compatible with preformed solder foil processes. Programmable multi-stage vacuum pumping function: Each chamber is equipped with an independent vacuum pump and control system, with a vacuum level ≤ 20 Pa and a pumping speed of 200 m³/h. A soft pumping valve is installed for adjustable pumping rate. The vacuum value of the chamber is displayed in real time and can be controlled and adjusted.
    High-Cleanliness Vacuum Soldering System with Low Void & Flux-Free Capability — H3

    High-Cleanliness Vacuum Soldering System with Low Void & Flux-Free Capability — H3

    Observation System The chamber is equipped with a viewing window for real-time observation of the soldering process. Heating System The system is configured with 3 independent heating modules (for H3) / 5 independent heating modules (for H5), all operating simultaneously in a vacuum environment.
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