High-Cleanliness Vacuum Soldering System with Low Void & Flux-Free Capability — H3

Observation System The chamber is equipped with a viewing window for real-time observation of the soldering process. Heating System The system is configured with 3 independent heating modules (for H3) / 5 independent heating modules (for H5), all operating simultaneously in a vacuum environment. Vacuum System Equipped with a large-scale vacuum pump to rapidly achieve a vacuum level below 10 Pa in the furnace chamber. Cooling System Adopts a water cooling system to ensure rapid cooling even under high-temperature vacuum conditions. Software System Programmable temperature ramp-up and ramp-down control, allowing users to set customized thermal profiles. Each profile can be automatically generated, edited, modified, and stored. Control System Modular software design enables independent configuration of process profiles, vacuum pumping, atmosphere control, and cooling cycles. These processes can be combined for one-click automated production. Atmosphere System Supports flux-free soldering and can be filled with reductive or protective gases such as N₂/H₂ mixture, HCOOH (formic acid), and N₂, ensuring a solder joint void ratio of less than 1%. The hydrogen (H₂) function is optional. Data Logging System Features uninterrupted real-time monitoring and data recording, including software profile logging, temperature control curve storage, process parameter saving, equipment parameter recording, and profile retrieval. Safety Protection System Integrates 8 safety monitoring and protection functions: Workpiece over-temperature protection Overall equipment temperature safety protection Low/high air pressure alarm and protection Water pressure protection Safe operation protection Cooling water circuit protection during soldering Liquid level protection Power failure protection Application Fields IGBT modules, MEMS packaging, LED packaging, automotive lighting, high-power semiconductor devices, optoelectronic device packaging, hermetic packaging, microwave device packaging, and microelectronic production lines for various products. Key Technical Parameters A. Vacuum Level: ≤ 10 Pa, with real-time display, programmable control and regulation of the chamber vacuum. B. Vacuum Pumping Speed: 50 m³/h C. Process Chamber Pressure Range: 10–1000 Pa D. Heating Plate Layer Load Capacity: ≥ 20 kg per layer E. Rapid Cooling Rate: Independent water and gas cooling units are installed in the chamber, enabling fast cooling of welded components. F. Low Void Soldering Quality: Ensures a void ratio of less than 1% on large-area pads after soldering. G. Solder Compatibility: Suitable for high-quality soldering in high-temperature and vacuum environments with materials such as AuSn solder foils, high-lead solders, and lead-free solder pastes. H. High Productivity: Each layer has an effective soldering area of 500 × 300 mm, and multi-layer simultaneous operation enables mass production of devices.