The DB80H Series is a high-precision die bonder. The whole machine adopts a precision motion platform to ensure the overall motion accuracy meets the mounting precision requirements. A nozzle pressure feedback system is optional to realize pressure mounting; a nozzle heating system is optional to realize eutectic mounting; and a dispensing system is optional to realize dispensing mounting. The mounting accuracy of the system can reach up to 5μm with different configurations, and the nozzle can be manually replaced for chips of different sizes. It is an essential equipment for high-precision die attach and bonding in high-end medical devices (core imaging module assembly), optical devices (laser LD bar assembly, VCSEL, PD, LENS assembly, etc.) and semiconductor chips (MEMS devices, RF devices, microwave devices and hybrid circuits). It is ideal for the R&D and small-batch, multi-variety production needs of research institutions such as research institutes, military units, universities and corporate laboratories. The product features high precision, stable performance and high cost performance, with extremely easy operation, making it particularly suitable for high-precision chip assembly. Standard Configuration Mounting system Visual calibration system (for systematic inspection and calibration of the mounted chip accuracy) Mounting platform Vacuum system High-precision visual alignment system Servo motion control system Optional Configuration Top nozzle heating module Nozzle pressure feedback system Dispensing and UV curing module Nitrogen protection gas module Substrate preheating module Eutectic platform Chip flip-chip mounting module