Hot Plate Water-Cooled Vacuum Eutectic Furnace — RS300

RS Series Vacuum Reflow Soldering Machine The RS Series Vacuum Reflow Soldering Machine is the third-generation compact vacuum reflow soldering equipment launched by Tongzhi Technology. Specifically designed for small-batch production, R&D and functional material testing, it employs heating in a vacuum environment to achieve void-free solder joints, fully meeting the testing and small-batch production needs of R&D departments. The RS Series can reduce the void ratio in the soldering area of devices to 2%, in stark contrast to the 20%–30% void ratio of conventional reflow soldering machines. It supports flux-free soldering for void-free joints and is compatible with various atmospheric conditions using different gases (N₂, N₂/H₂ 95%/5% mixture). The system is adaptable to lead-free solder paste or solder sheet processes, as well as fluxless soldering techniques. Equipped with a user-friendly software control system, the RS Series allows direct equipment operation and flexible setting, modification, and creation of soldering profiles tailored to different process requirements. It is primarily engineered for high-reliability soldering applications where even nitrogen-protected or vapor phase soldering fails to meet standards, such as military products and industrial-grade high-reliability components. It is the ideal solution for scenarios demanding high circuit soldering reliability—including material testing, chip packaging, power equipment, automotive products, train control, and aerospace systems—where eliminating or minimizing voids and oxidation in soldering materials is critical. Vacuum reflow soldering, a technological innovation pioneered by military welding experts in Germany, Japan, the United States and other countries, is indispensable for achieving superior soldering quality. Industrial Applications The RS Series is an ideal choice for R&D, process development, material testing and device packaging trials, and a preferred solution for high-end R&D and production in military enterprises, research institutes, universities, aerospace and other sectors. Application Fields It is mainly used for defect-free welding and high-quality fluxless soldering of chip-substrate and package-lid assemblies, including: IGBT packaging Solder paste processes Laser diode packaging Hybrid integrated circuit packaging Package-lid sealing MEMS packaging Vacuum packaging Vacuum reflow soldering has now become a must-have piece of equipment for high-end manufacturing in military, aerospace and aviation industries in developed countries such as Europe and the United States, and is widely applied in chip packaging, electronic soldering and other fields.

Welding in a true vacuum environment, with a vacuum level of up to 10⁻³ mbar (10⁻⁶ mbar optional). Soldering environment compatible with low-activity flux. Professional software control for an optimal user experience. Industry-leading 40-segment programmable temperature control system, enabling the creation of optimal process profiles. Adjustable temperature settings to achieve process profiles that closely match the requirements of soldering materials. Water-cooling technology for rapid cooling (standard configuration). In-line temperature measurement function, enabling precise measurement of temperature uniformity in the welding area and providing expert-level support for process tuning. Compatible with nitrogen or other inert gases to meet the requirements of special soldering processes. Maximum temperature of 450℃ (higher temperatures optional), meeting the requirements of all soft soldering processes. Supports simultaneous heating of upper and lower chambers. 

Standard Configuration Main unit × 1 Industrial-grade control computer × 1 Temperature control software × 1 set Temperature controller × 1 set Pressure controller × 1 set Inert gas/nitrogen control valve × 1 set Optional Configuration Corrosion-resistant diaphragm pump (vacuum level: 10 mbar) Rotary vane pump (for 10⁻³ mbar vacuum) Turbomolecular pump system (for 10⁻⁶ mbar vacuum) High-temperature module (max. temperature: 500℃)