Soldering Temperature Maximum actual soldering temperature ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 380 mm × 310 mm Furnace Chamber Height ≤ 100 mm Heating Method Adopts bottom + top infrared radiation heating. The heating plate features a semiconductor-grade graphite-coated silicon carbide platform, which is resistant to deformation during long-term use and boasts high thermal conductivity for more uniform surface temperature of the heating plate. Temperature Uniformity ≤ ±2% within the effective soldering area Temperature Rise Rate Maximum 120℃/min The V4DM is equipped with upper heating, which not only improves heating efficiency but also ensures more uniform platform temperature, enhancing soldering consistency and quality. Cooling Rate Maximum 120℃/min (range: no-load maximum temperature to 150℃) Silicon Carbide Heating Platform Adopts combined air + water cooling to achieve rapid cooling of the heating plate, increase the cooling rate, and prevent poor device sintering caused by excessive temperature difference during cooling. Solder Compatibility Suitable for soldering with various solders (≤ 450℃), including preformed solder foils such as In97Ag3, In52Sn48, Au80Sn20, SAC305, Sn90Sb10, Sn63Pb37, Sn62Pb36Ag2 (enabling flux-free eutectic soldering), and solder pastes of all compositions. Soldering Void Ratio Validated by numerous customers, the V4DM can control the void ratio to below 2% for soft solder soldering. Optional Positive Pressure Module The furnace can be equipped with an optional positive pressure module (≤ 0.2 Mpa), supporting both positive and negative pressure processes. The positive pressure process can effectively solve device displacement of micro-components during soldering (e.g., MiniLED, MicroLED) and flux splashing in solder paste processes (e.g., lead frame products). Temperature Control & Measurement System Adopts advanced temperature control technology with a control accuracy of ±1℃. Allows setting of up to 40 temperature segments for the temperature profile and is configured with 6 groups of PID settings for more precise temperature control, ensuring soldering consistency and reliability. Temperature control is a lagging control, while PID control features predictive regulation to improve control accuracy and stability. Comes standard with 2 sets of temperature-measuring thermocouples inside the furnace chamber. The thermocouples can real-time feed back the temperature at any position in the chamber during operation, and the temperature profile is displayed in real time on the control software, ensuring optimal temperature control of the soldering area and supporting the formulation of ideal process profiles. Furnace Chamber Atmosphere Can be filled with nitrogen (an inert gas) for auxiliary soldering, and supports reductive atmosphere processes such as formic acid and nitrogen-hydrogen mixture (5% H₂ + 95% N₂). The process atmosphere is precisely controlled by time or MFC (Mass Flow Controller) to ensure consistency of each set process. Realizes flux-free soldering. Software Control System Based on the Windows operating system with a user-friendly interface. Supports process programming via setting process parameters such as temperature, time, pressure and vacuum; the software automatically controls the entire process. Allows an unlimited number of process actions in profile programming to meet complex process requirements. Supports setting, modification, storage and retrieval of various soldering profiles for different processes. Built-in analysis function to analyze process profiles and identify key parameters such as temperature rise, constant temperature and cooling stages. Automatically records soldering processes and temperature control/measurement profiles in real time, ensuring process traceability of devices; all data is automatically saved in the corresponding directory by process operation time. Structural Features Adopts a fully automatic closed chamber structure for reliable long-term use. The upper cover closes automatically without causing device displacement, avoiding negative impacts of device vibration on soldering quality. The single-chamber design supports both heating and cooling processes. The upper cover is equipped with a viewing window for observing the device sintering process via a microscope. The upper cover lifts and lowers automatically; all operations except manual loading and unloading are controlled by software. The heating plate is made of pure material without additional structures such as cold water pipes, ensuring more uniform temperature. Adopts Tongzhi Technology's water cooling technology: water cooling does not affect the temperature uniformity of the thermal field during heating; each heating plate is equipped with 6 independent water cooling units during cooling for higher temperature uniformity. It is especially suitable for high-quality packaging and soldering such as AuSn eutectic soldering and indium solder eutectic soldering. Standard Configuration Main unit × 1 Industrial-grade control computer × 1 Vacuum sintering furnace control software system × 1 set Nitrogen atmosphere system + Formic acid atmosphere system MFC (Mass Flow Controller) × 1 Graphite-coated silicon carbide heating platform × 1 Optional Configuration Vacuum pump (mechanical dry pump) Turbomolecular pump system Digital nitrogen-hydrogen mixture atmosphere system Positive pressure module CCD vision system / Microscope Nitrogen-hydrogen mixture atmosphere system 
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