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Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-9
Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%.
Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points.
Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s.
Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12
Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%.
Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points.
Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s.
Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-16
Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%.
Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points.
Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s.
Inline Vacuum Reflow Oven — VRO945
The VRO945 Inline Vacuum Reflow Oven features high output, low energy consumption and low nitrogen consumption.
It is specially optimized and designed for the special vacuum soldering and packaging requirements of lead frame products and CLIP products in the semiconductor industry. A carefully optimized vacuum reflow oven developed in response to various challenges encountered by customers in the current industry.
Vacuum Formic Acid Oven — V8SL
The V8SL vacuum formic acid reflow oven features ultra-low vacuum degree, high throughput, low energy consumption, low nitrogen consumption and compact footprint.
Specifically optimized and designed for the semiconductor industry, the V8SL is a dedicated vacuum oven for vacuum welding and packaging of lead frame products, LED products and power devices, addressing various pain points currently faced by industry customers.
