Fully Automatic In-Line Vacuum Positive Pressure Sintering/Curing Oven — PEO100

The PEO100 vacuum positive pressure sintering oven is equipped with a dedicated software control system with the following features: The software control system is based on the Windows operating system for easy operation. It supports process programming via setting process conditions including temperature, time, pressure and vacuum; the software automatically controls the entire process with unlimited process actions configurable in process curve programming, meeting the requirements of complex processes. The control system is compatible with various welding process curves, supporting parameter setting, modification, storage and recall for different processes. It has a built-in analysis function for process curves to determine key process information such as temperature rise, constant temperature and temperature drop stages. The software control system automatically records welding processes, temperature control and temperature measurement curves in real time to ensure process traceability of devices, with all data automatically saved in the corresponding directory by process working time. The PEO100 adopts a fully automatic closed cavity structure for reliable long-term operation, with an integrally auto-lifting upper cover. After the upper cover is opened, the automatic motion mechanism of the PEO100 realizes automatic loading and unloading of workpieces. The heating plate of the PEO100 is made of pure material without additional structures such as cooling water pipes, ensuring superior temperature uniformity. The PEO100 adopts the 6th generation water cooling technology of Zhongke Tongzhi: water cooling does not affect the temperature uniformity of the thermal field during heating; the heating plate and water cooling system are precisely matched to achieve rapid water cooling during the cooling stage with higher temperature uniformity. It is particularly suitable for high-quality packaging and welding of high-end devices such as silicon carbide (SiC) chips. In the field of adhesive curing, the PEO100 is capable of alternating positive and negative pressure curing, which can effectively improve adhesive filling rate and enhance the bottom adhesive filling effect of package-based devices. Standard Configuration High positive pressure module (10kg/cm) Non-stop heater replacement system Rapid gas charging system Nitrogen atmosphere system One MFC mass flow meter Graphite-coated silicon carbide heating platform Optional Configuration Vacuum pump (mechanical dry pump) Formic acid atmosphere system Hydrogen-nitrogen mixed gas atmosphere system Digital hydrogen-nitrogen mixed gas atmosphere system