Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s. Vacuum level, vacuum holding time, gas release time, vacuum pumping rate and other parameters can be freely set. Capable of soldering circuit boards equipped with aluminum heat sinks. Environment-friendly design with ultra-low power consumption and high thermal insulation performance, and the shell temperature remains below 40℃. Equipped with a high-efficiency, large-capacity flux recovery device. Adopts integrated oxygen sensor technology to ensure precise control of oxygen content, and enables real-time/continuous monitoring of residual oxygen content in the furnace chamber. The equipment can also be used as a conventional nitrogen or air reflow oven.
The RS330B vacuum eutectic welding machine is the 3rd-generation compact vacuum reflow welding equipment launched by Zhongke Tongzhi. Exclusively designed for small-batch production, R&D and functional material testing, it heats workpieces in a high-vacuum environment to achieve void-free solder joints, fully meeting the testing requirements of R&D departments and production needs of small-batch manufacturing. This machine can reduce the void rate of the welding area of bonded devices to ≤2%, while the void rate of conventional reflow welding typically ranges from 20% to 30%. It supports flux-free welding for void-free solder joints and is compatible with various protective atmospheres including N₂/H₂ (95%/5%) and formic acid (CHOOH). The RS series is adaptable to lead-free solder paste/solder sheet processes as well as flux-free welding processes. Its software control system features simple operation, enabling direct equipment control, programming of various welding process curves, and customization/modification of curves for different processes. The RS330B is engineered for high-reliability welding fields with stringent requirements (e.g., military products and industrial high-reliability products), where nitrogen-protected welding or vapor phase welding fails to meet the required product reliability standards. It is the ideal solution for applications demanding ultra-high circuit welding reliability—such as material testing, chip packaging, power equipment, automotive products, train control systems, aerospace and aviation systems—by eliminating or minimizing voids and oxidation in welding materials. Reducing void rate and oxidation of solder pads or component pins is critical for high-quality welding, a technological innovation widely adopted by welding experts in the military fields of Germany, Japan, the United States and other developed countries. Industry & Application Fields Ideal for: R&D, process development, material testing and device packaging testing; a premium choice for high-end R&D and production in military enterprises, research institutes, universities, aerospace and aviation fields. Core Applications: Defect-free welding and high-quality flux-free welding of chip-substrate and package lid-baseplate assemblies, applicable to IGBT packaging, solder paste processes, laser diode packaging, hybrid integrated circuit packaging, package lid sealing, MEMS packaging and vacuum packaging. Vacuum reflow welding equipment has become essential equipment for high-end manufacturing in the military, aerospace and aviation industries of developed countries in Europe and America, and is widely used in chip packaging and electronic welding fields. Core Performance & Features Welding in a true high-vacuum environment: Minimum vacuum degree up to 0.6Pa; time to reach vacuum ≤5Pa at room temperature ≤1min. Adaptable to low-activity flux welding environment for high-purity welding processes. Real-time temperature measurement for precise detection of temperature uniformity in the welding area, providing expert-level support for process calibration. Industry-leading 40-segment programmable temperature control system for customizing optimal welding process curves. Adjustable temperature settings to create process curves that perfectly match the thermal characteristics of welding materials. Adopts Zhongke Tongzhi water cooling technology for rapid temperature reduction (standard configuration). Adopts Zhongke Tongzhi heating technology for superior temperature uniformity of ±1%. Compatible with nitrogen and other inert gases to meet the requirements of special welding processes. Maximum working temperature of 500℃ (higher temperature optional), satisfying all soft soldering process requirements. High-precision temperature control: ±0.5℃ within the effective welding area, with temperature uniformity ≤±1.5%. Equipped with vision inspection function with a minimum resolution of the detection system ≤2μm. Supports simultaneous heating of upper and lower temperature zones for uniform heating of workpieces. Standard Configuration Main unit × 1 set Control software system × 1 set Flux recovery system × 1 set Vision inspection system × 1 set Formic acid atmosphere module × 1 set Dry pump & industrial water chiller × 1 set each Industrial-grade control computer × 1 unit Temperature control software × 1 set Temperature controller × 1 set Pressure controller × 1 set Process gas control system × 1 set
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