Water & Nitrogen Cooling Vacuum Soldering Oven RS330

The RS Series Hydrogen Vacuum Reflow Soldering Machine is the third-generation compact vacuum reflow soldering equipment launched by Tongzhi Technology. Exclusively designed for small-batch production, R&D design, functional material testing and other applications, it adopts heating in a vacuum environment to achieve void-free solder joints, fully meeting the testing and small-batch production requirements of R&D departments.

The NS Series Vacuum Reflow Soldering Machine is the third-generation compact vacuum reflow soldering equipment launched by Zhongke Tongzhi. Specifically engineered for small-batch production, R&D design and functional material testing, this compact vacuum reflow soldering system adopts heating in a vacuum environment to achieve void-free solder joints, fully meeting the testing and small-batch production requirements of R&D departments.

Soldering Temperature Maximum actual soldering temperature of the V3D Thermal Separation Vacuum Eutectic Furnace ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 0.2 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 300 mm × 300 mm Furnace Chamber Height 100 mm

Main unit × 1 Industrial-grade touch screen control computer × 1 Corrosion-resistant diaphragm pump (Vacuum level: 10 mbar) × 1 Rotary vane pump (For 10 mbar vacuum) × 1 Temperature controller × 1 Pressure controller × 1 set Closed-loop water cooling system × 1 set 4-channel temperature measurement module × 1 set Vacuum pressure transmitter × 1 Inert gas/nitrogen control valve × 1 set Water tank × 1 Chiller × 1

Standard Configuration Main unit × 1 Industrial-grade touch screen control computer × 1 Corrosion-resistant diaphragm pump (vacuum level: 10 mbar) × 1 Rotary vane pump (for 10 mbar vacuum) × 1 Temperature controller × 1 Pressure controller set × 1 Closed-loop water cooling system set × 1 4-channel temperature measurement module set × 1 Vacuum pressure transmitter × 1 Inert gas/nitrogen control valve set × 1 Water tank × 1 Chiller × 1