The Pressure Curing Oven (PCO-31) is mainly applied in wafer bonding processes, especially for die attach and underfill applications. As an autoclave, it can reduce micro-bubbles and enhance bonding strength. The PCO-31 operates by injecting high-pressure gas into a pressure vessel, with a built-in air blowing mechanism to generate convection of the internally heated high-pressure gas. Heaters and heat exchangers are installed inside the pressure vessel. Upon completion of the process, the pressure vessel will automatically release pressure to normal pressure and cool down. Applications of Pressure Curing Wafer lamination, thermocompression wafer bonding, die attach curing, chip underfill curing, via silicon filling, film and strip bonding, composite molding in the printing industry.