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    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12
    • Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12

    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12

    Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s.
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    Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s. Vacuum level, vacuum holding time, gas release time, vacuum pumping rate and other parameters can be freely set. Capable of soldering circuit boards equipped with aluminum heat sinks. Environment-friendly design with ultra-low power consumption and high thermal insulation performance, and the shell temperature remains below 40℃. Equipped with a high-efficiency, large-capacity flux recovery device. Adopts integrated oxygen sensor technology to ensure precise control of oxygen content, and enables real-time/continuous monitoring of residual oxygen content in the furnace chamber. The equipment can also be used as a conventional nitrogen or air reflow oven.

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    High-Temperature Nitrogen Curing Oven — A904D

    High-Temperature Nitrogen Curing Oven — A904D

    The electrical components adopted for the main electrical section and the temperature control design reach an advanced level with high uniformity. This oven is suitable for processes such as adhesive curing, chip curing, module curing, as well as high-temperature dehumidification and high-temperature aging of electronic products. The curing chamber features an advanced sealing design with multi-stage sealing for complete airtightness, ensuring products undergo thermal curing and aging in a relatively sealed nitrogen environment, which improves product quality and long-term operational stability.
    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12

    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12

    Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s.
    High-Temperatur...
    High-Temperature Nitrogen Curing Oven — A904D
    The electrical components adop...
    Inline Hot Air ...
    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12
    Drastically reduces welding bu...
    • Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12

    • Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s. Vacuum level, vacuum holding time, gas release time, vacuum pumping rate and other parameters can be freely set. Capable of soldering circuit boards equipped with aluminum heat sinks. Environment-friendly design with ultra-low power consumption and high thermal insulation performance, and the shell temperature remains below 40℃. Equipped with a high-efficiency, large-capacity flux recovery device. Adopts integrated oxygen sensor technology to ensure precise control of oxygen content, and enables real-time/continuous monitoring of residual oxygen content in the furnace chamber. The equipment can also be used as a conventional nitrogen or air reflow oven.

    High-Temperature Nitrogen Curing Oven — A904D

    High-Temperature Nitrogen Curing Oven — A904D

    The electrical components adopted for the main electrical section and the temperature control design reach an advanced level with high uniformity. This oven is suitable for processes such as adhesive curing, chip curing, module curing, as well as high-temperature dehumidification and high-temperature aging of electronic products. The curing chamber features an advanced sealing design with multi-stage sealing for complete airtightness, ensuring products undergo thermal curing and aging in a relatively sealed nitrogen environment, which improves product quality and long-term operational stability.
    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12

    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12

    Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s.
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