Inline Formic Acid Vacuum Sintering Furnace — VF680

The furnace consists of 3 independent process chambers for preheating, heating and cooling respectively; each chamber is equipped with a viewing window, and the pressure of the process chamber ranges from 0.2 to 1050 mbar. The furnace supports and enables precise control of nitrogen, formic acid (nitrogen + formic acid) atmospheres, and is compatible with preformed solder foil processes. Programmable multi-stage vacuum pumping function: Each chamber is configured with an independent vacuum pump and control system, with a vacuum level ≤ 1 mbar and a pumping speed of 100 m³/h. A soft pumping valve is installed for adjustable pumping rate. The vacuum value of the chamber is displayed in real time and can be controlled and adjusted. Adopts heating plate contact heating and cooling plate contact heat dissipation; the area of heating plate and cooling plate is 685×350 mm, and the interlayer load capacity of the heating plate ≤ 20 kg. The temperature rise rate is 1–3℃/S and the temperature drop rate is 3–6℃/S, both of which are programmable and controllable. Operating temperature: room temperature ~ 400℃; temperature control accuracy ≤ ±0.5℃; temperature uniformity ≤ ±1%. Soldering void ratio: Single void ratio after soldering ＜ 2%, total void ratio ≤ 3% (for components above 10×10 mm). The process profile can be adjusted according to specific requirements. Chip displacement without fixture positioning after soldering meets process requirements (displacement ≤ 0.2 mm, angle deviation ≤ 1°). Process control: The temperature gradient and time of each stage during soldering can be freely programmed and saved as required; Automatic generation of all process profiles and editing of process programs are achievable; Equipped with a digital Mass Flow Controller (MFC) for precise control of process gas flow. Self-developed control program with real-time monitoring and data recording functions, which displays and records temperature, flow and vacuum data in real time; equipped with program permission management (administrator, process engineer, operator) to prevent accidental modification of program parameters. The furnace is equipped with multiple alarm functions: chamber leakage alarm (triggered when vacuum failure or gas leakage is detected), gas circuit pressure supply alarm (triggered when gas circuit pressure is too low), chamber overpressure alarm (triggered when chamber pressure is too high), formic acid level alarm (triggered when formic acid level is too low), over-temperature alarm (triggered when temperature exceeds the set value). It is configured with an independent gas protection system, and all electrical doors are equipped with locking devices. The average service life (flatness) of the heating plate is more than 5 years; the temperature control system has an intelligent temperature calibration function for temperature difference compensation. It is equipped with MES function, which can open corresponding interfaces and functions to obtain customer-required information, complying with the SEMI communication standard SECS/GEM. Equipped with track interfaces at the front and rear, which can be docked with chip mounters via tracks. The furnace features a modular design with a separate structure for heating tubes and heating plates. If the temperature uniformity changes during long-term use, the entire heating plate does not need to be replaced, and only partial heating tubes can be replaced directly. This design facilitates adjusting the temperature uniformity of each heating plate, and enables easy maintenance and temperature performance calibration.