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Formic Acid Reflow Oven — V3DR
Soldering Temperature
Maximum actual soldering temperature of the V3DR Formic Acid Reflow Oven ≤ 600℃
Vacuum Level
Ultimate vacuum ≤ 0.3 Pa; Working vacuum: 5 Pa – 200 Pa
Temperature Uniformity
≤ ±1% within the effective soldering area
Effective Soldering Area
≤ 300 mm × 300 mm
Inline Formic Acid High-Vacuum Sintering Furnace — VX410
The furnace consists of 5 zones: Loading Zone, Preheating Zone, Heating Zone, Cooling Zone and Unloading Zone.
It is configured with a double-layer vacuum chamber (internal and external), a distinctive design compared with single-layer vacuum chambers of similar equipment. The double-layer structure ensures zero workpiece oxidation and formic acid leakage prevention, with the oxygen content maintained below 5 ppm.
Inline Formic Acid Vacuum Sintering Furnace — VF400
The furnace consists of 4 independent process chambers: 2 Preheating Zones, 1 Heating Zone and 1 Cooling Zone; each chamber is fitted with a viewing window, and the pressure of the process chamber ranges from 20 to 200 Pa.
The furnace supports and enables precise control of nitrogen, formic acid (nitrogen + formic acid) atmospheres, and is compatible with preformed solder foil processes.
Programmable multi-stage vacuum pumping function: Each chamber is equipped with an independent vacuum pump and control system, with a vacuum level ≤ 20 Pa and a pumping speed of 200 m³/h. A soft pumping valve is installed for adjustable pumping rate. The vacuum value of the chamber is displayed in real time and can be controlled and adjusted.
Inline Formic Acid Vacuum Sintering Furnace — VF300
The furnace consists of 3 independent process chambers for Preheating, Heating and Cooling respectively; each chamber is fitted with a viewing window, and the pressure of the process chamber ranges from 0.2 to 1050 mbar.
The furnace supports and enables precise control of nitrogen, formic acid (nitrogen + formic acid) atmospheres, and is compatible with preformed solder foil processes.
Programmable multi-stage vacuum pumping function: Each chamber is equipped with an independent vacuum pump and control system, with a vacuum level ≤ 1 mbar and a pumping speed of 100 m³/h. A soft pumping valve is installed for adjustable pumping rate. The vacuum value of the chamber is displayed in real time and can be controlled and adjusted.
Inline Vacuum Reflow Oven — VRO945-3
The VRO945-3 Inline Vacuum Reflow Oven features high output, low energy consumption and low nitrogen consumption.
It is specially optimized and designed for the vacuum soldering and packaging needs of lead frame products and CLIP products in the semiconductor industry. It is a carefully engineered vacuum reflow oven developed to address common challenges faced by industry customers.
