NS Series Vacuum Reflow Soldering Machine — NS200

The NS Series Vacuum Eutectic Furnace is the third-generation compact vacuum eutectic furnace launched by Zhongke Tongzhi. Specially developed for small-batch production, R&D and functional material testing, the equipment heats workpieces in a vacuum environment to form void-free solder joints, fully meeting the testing and small-volume production requirements of R&D departments. This furnace can lower the void rate in the bonding area of welded components to only 2%, compared with 20%~30% achieved by conventional eutectic furnaces. It supports flux-free soldering for void-free joints and works with various process atmospheres including N₂ and 95%N₂/5%H₂ mixed gas.

The NS Series is compatible with lead-free solder paste and solder preform processes, as well as flux-free bonding processes. Equipped with an intelligent software control system, the furnace features user-friendly operation. Operators can directly control the equipment, set diverse soldering profiles, and modify or create new process curves to fit different production demands.

Designed for high-reliability soldering scenarios where nitrogen-protected or vapor-phase soldering cannot meet stringent quality standards, such as military-grade products and high-reliability industrial components, this furnace effectively eliminates or minimizes voids and oxidation in solder layers for applications including material testing, chip packaging, power equipment, automotive electronics, train control systems, aerospace and avionics systems. As an innovative bonding technology developed by military welding specialists from Germany, Japan, the United States and other industrialized nations, vacuum eutectic bonding is the optimal solution to cut void ratio and prevent oxidation on pads and component pins for premium soldering quality.

Industry Applications

The NS Series Vacuum Eutectic Furnace serves as an ideal tool for R&D, process development, material testing and component packaging trials. It is widely adopted for high-end research and mass production in military enterprises, research institutes, universities, aerospace and related industries.

Application Fields

It is mainly used for defect-free and high-quality flux-free bonding between chips and substrates, packages and lids, covering IGBT packaging, solder paste processes, laser diode packaging, hybrid integrated circuit packaging, package lid sealing, MEMS and vacuum packaging.

Nowadays, vacuum eutectic furnaces have become essential equipment for military manufacturers, aerospace and other high-end manufacturing sectors in Europe, America and other developed regions, and have been extensively applied in chip packaging and precision electronic soldering.

Technical Specifications

Authentic vacuum soldering environment with a maximum vacuum degree of 1 Pa.

Optional slight positive pressure configuration up to 0.3 MPa.

Pressure holding performance: The internal chamber vacuum level remains below 30 Pa within 30 minutes (test condition: evacuate to 10 Pa then close valves for pressure retention), suitable for soldering with low-activity flux.

Professional software control system delivers an intuitive and excellent operating experience.

Industry-leading 40-segment programmable temperature control system for optimizing custom process curves.

Flexible temperature adjustment enables users to tailor process curves matching the thermal characteristics of different soldering materials.

Standard rapid cooling system for fast temperature reduction.

On-line temperature measurement function precisely detects temperature uniformity across the bonding zone, providing professional data support for process optimization and parameter calibration.

Compatible with process gases such as formic acid, nitrogen and nitrogen-hydrogen mixture to fulfill special soldering process requirements.

Maximum operating temperature: 750 ℃ (custom temperature options available), covering all soft soldering processes.

Supports simultaneous heating of upper and lower heating zones.

Overall dimension: 800 × 900 × 1650 mm

Rated input voltage: 220 V (380 V available as an option)