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    Inline Vacuum Formic Acid Oven — V8N-6
    • Inline Vacuum Formic Acid Oven — V8N-6

    Inline Vacuum Formic Acid Oven — V8N-6

    The V8N Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. It is specially optimized and designed for the vacuum soldering and packaging needs of IGBT modules and MOSFET devices in the power semiconductor industry. This is a carefully engineered vacuum oven developed to address common challenges faced by industry customers.

    The V8N Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. It is specially optimized and designed for the vacuum soldering and packaging needs of IGBT modules and MOSFET devices in the power semiconductor industry. This is a carefully engineered vacuum oven developed to address common challenges faced by industry customers. Core Advantages High Output: Completes soldering of one batch of IGBT modules every 4–10 minutes. Low Energy Consumption: Total startup power: 66 KW; Average operating power: 10–12 KW. Low Nitrogen Consumption: Nitrogen usage is only 1/2–2/3 that of comparable vacuum ovens. Compact Footprint: Overall dimensions: 4550 × 1200 × 1620 mm. Solder Compatibility Suitable for soldering with various solders (≤400℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste, and other solder paste formulations. Soldering Void Ratio Pad void ratio: < 2% Single void ratio: < 1% Note: Different soldering materials and atmospheres will affect results. These values are based on comprehensive customer testing and may vary by product. Key Functional Features Supports both nitrogen and formic acid atmosphere operation to accommodate multiple soldering processes. Equipped with a software control system featuring a modular design and an intuitive, user-friendly interface. Requires no calibration, eliminating additional calibration costs.

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    Inline Formic Acid High-Vacuum Sintering Furnace — VX410

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    Inline Formic Acid Vacuum Sintering Furnace — VF300

    The furnace consists of 3 independent process chambers for Preheating, Heating and Cooling respectively; each chamber is fitted with a viewing window, and the pressure of the process chamber ranges from 0.2 to 1050 mbar. The furnace supports and enables precise control of nitrogen, formic acid (nitrogen + formic acid) atmospheres, and is compatible with preformed solder foil processes. Programmable multi-stage vacuum pumping function: Each chamber is equipped with an independent vacuum pump and control system, with a vacuum level ≤ 1 mbar and a pumping speed of 100 m³/h. A soft pumping valve is installed for adjustable pumping rate. The vacuum value of the chamber is displayed in real time and can be controlled and adjusted.

    Inline Formic Acid Vacuum Sintering Furnace — VF400

    The furnace consists of 4 independent process chambers: 2 Preheating Zones, 1 Heating Zone and 1 Cooling Zone; each chamber is fitted with a viewing window, and the pressure of the process chamber ranges from 20 to 200 Pa. The furnace supports and enables precise control of nitrogen, formic acid (nitrogen + formic acid) atmospheres, and is compatible with preformed solder foil processes. Programmable multi-stage vacuum pumping function: Each chamber is equipped with an independent vacuum pump and control system, with a vacuum level ≤ 20 Pa and a pumping speed of 200 m³/h. A soft pumping valve is installed for adjustable pumping rate. The vacuum value of the chamber is displayed in real time and can be controlled and adjusted.

    High-Cleanliness Vacuum Soldering System with Low Void & Flux-Free Capability — H3

    Observation System The chamber is equipped with a viewing window for real-time observation of the soldering process. Heating System The system is configured with 3 independent heating modules (for H3) / 5 independent heating modules (for H5), all operating simultaneously in a vacuum environment.
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    The furnace consists of 5 zone...
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    • The V8N Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. It is specially optimized and designed for the vacuum soldering and packaging needs of IGBT modules and MOSFET devices in the power semiconductor industry. This is a carefully engineered vacuum oven developed to address common challenges faced by industry customers. Core Advantages High Output: Completes soldering of one batch of IGBT modules every 4–10 minutes. Low Energy Consumption: Total startup power: 66 KW; Average operating power: 10–12 KW. Low Nitrogen Consumption: Nitrogen usage is only 1/2–2/3 that of comparable vacuum ovens. Compact Footprint: Overall dimensions: 4550 × 1200 × 1620 mm. Solder Compatibility Suitable for soldering with various solders (≤400℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste, and other solder paste formulations. Soldering Void Ratio Pad void ratio: < 2% Single void ratio: < 1% Note: Different soldering materials and atmospheres will affect results. These values are based on comprehensive customer testing and may vary by product. Key Functional Features Supports both nitrogen and formic acid atmosphere operation to accommodate multiple soldering processes. Equipped with a software control system featuring a modular design and an intuitive, user-friendly interface. Requires no calibration, eliminating additional calibration costs.

    Inline Formic Acid High-Vacuum Sintering Furnace — VX610

    The furnace consists of 5 zones: Loading Zone, Preheating Zone, Heating Zone, Cooling Zone and Unloading Zone. It is configured with a double-layer vacuum chamber (internal and external), a distinctive design compared with the single-layer vacuum chambers of similar equipment. This double-layer structure ensures zero workpiece oxidation and formic acid leakage prevention, with the oxygen content maintained below 5 ppm.

    Inline Formic Acid High-Vacuum Sintering Furnace — VX410

    The furnace consists of 5 zones: Loading Zone, Preheating Zone, Heating Zone, Cooling Zone and Unloading Zone. It is configured with a double-layer vacuum chamber (internal and external), a distinctive design compared with single-layer vacuum chambers of similar equipment. The double-layer structure ensures zero workpiece oxidation and formic acid leakage prevention, with the oxygen content maintained below 5 ppm.

    Inline Formic Acid Vacuum Sintering Furnace — VF300

    The furnace consists of 3 independent process chambers for Preheating, Heating and Cooling respectively; each chamber is fitted with a viewing window, and the pressure of the process chamber ranges from 0.2 to 1050 mbar. The furnace supports and enables precise control of nitrogen, formic acid (nitrogen + formic acid) atmospheres, and is compatible with preformed solder foil processes. Programmable multi-stage vacuum pumping function: Each chamber is equipped with an independent vacuum pump and control system, with a vacuum level ≤ 1 mbar and a pumping speed of 100 m³/h. A soft pumping valve is installed for adjustable pumping rate. The vacuum value of the chamber is displayed in real time and can be controlled and adjusted.

    Inline Formic Acid Vacuum Sintering Furnace — VF400

    The furnace consists of 4 independent process chambers: 2 Preheating Zones, 1 Heating Zone and 1 Cooling Zone; each chamber is fitted with a viewing window, and the pressure of the process chamber ranges from 20 to 200 Pa. The furnace supports and enables precise control of nitrogen, formic acid (nitrogen + formic acid) atmospheres, and is compatible with preformed solder foil processes. Programmable multi-stage vacuum pumping function: Each chamber is equipped with an independent vacuum pump and control system, with a vacuum level ≤ 20 Pa and a pumping speed of 200 m³/h. A soft pumping valve is installed for adjustable pumping rate. The vacuum value of the chamber is displayed in real time and can be controlled and adjusted.

    High-Cleanliness Vacuum Soldering System with Low Void & Flux-Free Capability — H3

    Observation System The chamber is equipped with a viewing window for real-time observation of the soldering process. Heating System The system is configured with 3 independent heating modules (for H3) / 5 independent heating modules (for H5), all operating simultaneously in a vacuum environment.
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