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RS Series Hydrogen Vacuum Reflow Soldering Machine — RS220
The RS Series Hydrogen Vacuum Reflow Soldering Machine is the third-generation compact vacuum reflow soldering equipment launched by Tongzhi Technology. Exclusively designed for small-batch production, R&D design, functional material testing and other applications, it adopts heating in a vacuum environment to achieve void-free solder joints, fully meeting the testing and small-batch production requirements of R&D departments.
Thermal Separation Vacuum Eutectic Furnace — V3D
Soldering Temperature
Maximum actual soldering temperature of the V3D Thermal Separation Vacuum Eutectic Furnace ≤ 600℃
Vacuum Level
Ultimate vacuum ≤ 0.2 Pa; Working vacuum: 50 Pa – 200 Pa
Effective Soldering Area
≤ 300 mm × 300 mm
Furnace Chamber Height
100 mm
Thermal Separation Vacuum Eutectic Furnace — V4D
Soldering Temperature
Maximum actual soldering temperature ≤ 600℃
Vacuum Level
Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa
Effective Soldering Area
≤ 380 mm × 310 mm
Furnace Chamber Height
100 mm
Vacuum Eutectic Furnace V3
Standard Configuration
Main unit × 1
Industrial-grade touch screen control computer × 1
Corrosion-resistant diaphragm pump (vacuum level: 10 mbar) × 1
Rotary vane pump (for 10 mbar vacuum) × 1
Temperature controller × 1
Pressure controller set × 1
Closed-loop water cooling system set × 1
4-channel temperature measurement module set × 1
Vacuum pressure transmitter × 1
Inert gas/nitrogen control valve set × 1
Water tank × 1
Chiller × 1
