The Vapor Phase High Vacuum Reflow Soldering Machine is a professional industrial-grade high-vacuum reflow soldering equipment. Why Choose a High-Vacuum Reflow Soldering Machine? Currently, the mainstream soldering processes in the industry use tools or equipment such as soldering irons, wave soldering, and reflow soldering. Later, nitrogen protection was added, upgrading to nitrogen lead-free high-vacuum reflow soldering machines. However, for some high-demand soldering fields, such as military products and industrial-grade high-reliability products, even nitrogen protection cannot meet the reliability requirements of the products. For applications requiring high-reliability circuit soldering, such as material testing, chip packaging, power equipment, automotive products, train control, aerospace, and aviation systems, it is necessary to reduce voids and oxidation in soldering materials. A vacuum reflow soldering machine is the ideal choice for effectively reducing the void ratio and minimizing oxidation of solder pads or component pins. To achieve high soldering quality, a vacuum reflow soldering machine must be adopted. This is a technological innovation in SMT soldering from countries such as Germany, Japan, and the United States. Industrial Applications The Vapor Phase High Vacuum Reflow Soldering Machine is an ideal choice for R&D, process development, and production from low to high capacity. It is also an ideal solution for R&D and production in military enterprises, research institutes, universities, aerospace and other fields. Application Fields It is mainly used for defect-free welding and flux-free soldering of chips and substrates, packages and covers, such as IGBT packaging, solder paste processes, laser diode packaging processes, hybrid integrated circuit packaging, package cover packaging, MEMS and vacuum packaging. Vacuum reflow soldering has now become the preferred choice for military enterprises, aviation, aerospace and other manufacturing industries in developed countries such as Europe and the United States, and has been widely applied in fields such as chip packaging and electronic soldering. Core Technical Features Soldering in a true vacuum environment. Maximum vacuum degree of the vacuum chamber ≤ 0.5 mbar. Suitable for soldering environments with low-activity flux. Touch screen operation combined with professional software control for an excellent operating experience. Industry-leading 40-segment programmable temperature control system for setting soldering profiles. Equipped with ≥ 6-channel embedded temperature monitoring system in the soldering chamber. Temperature settings are adjusted via touch screen (up/down), and profiles can be directly dragged and edited to create processes that closely match the thermal characteristics of soldering materials. Water cooling technology for rapid cooling effect. Four sets of in-line temperature measurement functions for accurate measurement of temperature uniformity in the soldering area, providing support for process tuning. Optional formic acid, nitrogen or other inert gases to meet the requirements of special soldering processes. Integrated real-time on-line process video recording system. It records the soldering process of each product, providing strong evidence for future quality tracking and feedback. At the same time, this function provides data support for the research of soldering processes and material testing. Maximum temperature of 450℃ (higher temperature optional), meeting the requirements of all soft soldering processes. The top cover of the furnace chamber is equipped with a viewing window. Eight sets of system safety status monitoring and protection designs: Workpiece over-temperature protection Overall equipment temperature safety protection Air pressure protection Water pressure protection Safe operation protection Cooling water circuit protection during soldering Liquid level protection Power failure protection Standard Configuration Main unit × 1 Industrial-grade touch screen control computer × 1 Temperature controller × 1 set Closed-loop water cooling system × 1 set 4-channel temperature measurement module × 1 set Inert gas/nitrogen control valve × 1 set Water tank × 1 Chiller × 1 Optional Configuration Corrosion-resistant diaphragm pump (Vacuum level: 10 mbar) Rotary vane pump (Vacuum level: ≤ 5 Pa) Turbomolecular pump system (For 10⁻³ Pa vacuum) Formic acid system (Onboard installation) Component fixture
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