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NS Series Vacuum Reflow Soldering Machine — NS260
The NS Series Vacuum Reflow Soldering Machine is the third-generation compact vacuum reflow soldering equipment launched by Zhongke Tongzhi. Specifically engineered for small-batch production, R&D design and functional material testing, this compact vacuum reflow soldering system adopts heating in a vacuum environment to achieve void-free solder joints, fully meeting the testing and small-batch production requirements of R&D departments.
Thermal Separation Vacuum Eutectic Furnace — V4D
Soldering Temperature
Maximum actual soldering temperature ≤ 600℃
Vacuum Level
Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa
Effective Soldering Area
≤ 380 mm × 310 mm
Furnace Chamber Height
100 mm
High-Cleanliness Vacuum Soldering System with Low Void & Flux-Free Capability — H5
Observation System
The chamber is equipped with a viewing window for real-time observation of the soldering process.
Heating System
The system is configured with 3 independent heating modules (for H3) / 5 independent heating modules (for H5), all operating simultaneously in a vacuum environment.
High-Cleanliness Vacuum Soldering System with Low Void & Flux-Free Capability — H6
Observation System
The chamber is equipped with a viewing window for real-time observation of the soldering process.
Heating System
The system is configured with 6 independent heating modules (H6) that operate simultaneously in a vacuum environment.
Vacuum System
Equipped with a large-scale vacuum pump to rapidly achieve a vacuum level below 10 Pa in the furnace chamber.
Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-16
Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%.
Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points.
Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s.
