Suitable for mounting chip components in the post-package process of semiconductor integrated circuit production, enabling dispensing, adhesive dipping, die attach, chip mounting, wafer die attach and flip chip mounting for GaAs devices. The mounting pressure is programmably controllable with high precision. Adopting a precision magnetic levitation motion platform, the X and Y axes of the main system use a contactless and frictionless magnetic levitation system with high-resolution linear encoders. The encoder scale achieves an accuracy of 0.02μm, enabling high-speed, precise and submicron-level positioning. The platform is designed as a highly stable integrated granite high-speed motion platform, which allows the T8WS to achieve fast start-up time and a mounting accuracy of ±0.5μm and even better while ensuring thermal and mechanical stability, thus meeting the requirements of high-precision applications. Equipped with an independent dispensing control software for arbitrary setting of glue shape and path, it can realize dispensing in any shape such as dot, line, plane, non-plane, arc and circle, and is configured with an independent dispensing controller. The controller has an independent algorithm: the gas pressure is automatically increased according to the algorithm when the glue volume is high, and automatically decreased when the glue volume is low, ensuring the consistency of glue dispensing. The image recognition system consists of two sets of independent recognition systems. The top system is equipped with two sets of independent industrial cameras to realize the recognition of PCB MARK points and pads; the bottom system is equipped with an ultra-precision industrial camera with more than 10 image recognition algorithms, which can realize the precise recognition of relevant raw materials including feature points, pins, chip MARK points, special-shaped components and small substrates. The mounter is equipped with an automatic calibration function. It can be set to automatically calibrate the motion accuracy of the X and Y axes after a specified number of movements as required; when inaccurate positioning is detected, the motion axes can be calibrated through 3D automatic calibration. Meanwhile, the automatic calibration of dispensing needles and nozzles is realized through the bottom image recognition system. Rotation angle: The equipment is configured with a high-precision DD motor with a 360° rotation function and a rotation resolution of 0.001°, enabling chip mounting at any angle during the assembly process. Equipped with a precision dispenser, the software allows selection of Dispenser 1/2 alone or simultaneous operation of both. It can use two types of adhesives at the same time, or dispense with needles of two different diameters simultaneously. 1. Freely Configurable Working Area The gantry frame design provides a large working space. The system can pick up materials from any combination of feeding methods such as waffle packs, wafer feeders and tape feeders. For wafer feeding, the system uses a motor-driven, pressure-controlled lifting mechanism to pick up thin chips and high-aspect-ratio chips with precise compensation. Ink dot recognition and wafer mapping functions ensure that only known good dice (KGD) are picked up. The 700 square inch working area can easily accommodate a variety of combinations of feeding and discharging methods. 2. Assembly-Optimized Pressure Control The T8WS is equipped with a closed-loop pressure feedback function, making it ideal for handling GaAs and InP devices as well as fragile devices such as MEMS. The chip placement force can be as low as 100g, so fragile microstructures such as air bridges will not be damaged. The pressure for each placement is programmably controlled, so the pickup and placement of each chip are performed under the programmed pressure, helping to ensure the consistency of solder paste or adhesive layer thickness. 3. Material Handling The T8WS meets the requirements of specialized high-volume production while being flexible enough for low-volume production. It can be configured for stand-alone production with tray-to-tray material handling, or integrated in-line with other processing equipment. 4. Advanced Image Positioning and Vision System The advanced vision system enables rapid detection and positioning of chips within a 360° range, and has a strong substrate reference point calibration capability. This allows the calibration of chips with high orientation requirements such as MMICs and beam-lead diodes. The vision system calibrates and places chips based on the relative positions of substrate reference points, chip edges or feature points of previously placed chips, ensuring the repeatability and accuracy of alignment for optical and microwave devices. Edge detection or pattern recognition functions are adopted to locate the chip center, edges or key application features. The fast positioning function allows chips such as MMICs and lasers to be processed directly on the machine without any pre-positioning. Global and local vision calibration functions are applied to embedded substrate and feature code calibration, enabling fast and accurate processing of complex assemblies. Both the top and bottom cameras of the T8WS vision system have multiple magnifications and are equipped with programmable light sources. A single bottom camera is used for the production of flip chips and other parts with bottom features. 5. Programmable Multi-Color Backlight Illumination The light intensity of the ring light and coaxial light of each camera is programmably adjustable to determine the appropriate light source for chip alignment and recognition. Multi-color backlights can be used to process a wide range of materials. The optional red-green-blue (RGB) programmable light source provides enhanced capability for processing challenging calibration surfaces (such as gold wires on alumina ceramics). The powerful vision system ensures that production is not interrupted by calibration errors or omissions. 6. Vacuum Eutectic Soldering Function The T8WS can be optionally equipped with a vacuum eutectic soldering function and supports a variety of eutectic processes including Au-Si, Au-Sn and Au-Ge. It is featured with a heating eutectic furnace with fast vacuuming, closed-loop control and programmable heating ramp; the eutectic furnace is programmable to meet eutectic process requirements, and the heating rate is programmably controllable, which improves the eutectic reliability of components and avoids thermal shock at the same time. The T8WS supports both direct eutectic soldering and reflow soldering, with controllable contact pressure and programmable positive/negative pressure regulation, and the temperature can reach above 500°C. The preheating system can be optionally equipped with protective atmospheres such as nitrogen, hydrogen-nitrogen mixture or formic acid reduction to prevent oxidation of workpieces and substrates. The system automatically transfers the substrate or chip package to the vacuum eutectic furnace to complete vacuum eutectic soldering or vacuum formic acid eutectic soldering. In addition to packaging high-power devices such as amplifiers, these features of the T8WS can also be applied to the high-volume production of optical components in optical equipment, such as eutectic soldering on substrates, TO headers, butterfly packages, etc. 7. Solder Paste Jetting and Dispensing Function with Laser Ranging The equipment can be configured with a precision dispensing controller for conductive & insulating epoxy / precision solder paste jetting controller, a precision laser height rangefinder, as well as automatic positioning and cleaning of dispensing needles, ensuring high-precision dispensing or area filling. Through high-precision laser height detection, the T8WS achieves precise dispensing function. Each calibration detects the height of several points by laser to determine the slope of each dispensing surface. 8. Powerful Control System and Offline Programming System The T8WS features an intuitive Windows-based graphical user interface that simplifies setup and production processes. The software system includes a pre-programmed library for waffle packs and chips, its components are easy to learn and all substrate programs are applicable. The XML-format database simplifies data operation and offline programming. New vision tools such as adjustable target areas, enhanced gain control, filters and pattern matching enable visual processing of challenging substrate and chip materials. Functions such as CAD download, advanced calibration procedures, automatic program calling via QR codes on feed trays, material traceability and network connectivity mean almost no time is spent on programming, thus optimizing production efficiency and equipment utilization. The T8WS control platform achieves smoother and more precise control through a bus-based motion system and drivers for all axes (including conveyors). The computer hardware is configured with front-end USB interfaces for ease of use, and dual hard drives with backup function ensure data security, shorter downtime and faster data recovery. 9. True Turnkey Engineering TORCH provides a complete packaging solution, including a series of products such as high-speed precision mounters, silver paste dispensers, solder paste jet printers and epoxy dispensers. The SMEMA-compatible interface allows the T8WS to be integrated with a variety of equipment including in-line vacuum soldering furnaces, forming a turnkey production solution. TORCH's highly reliable systems and localized technical service support commitment ensure that your equipment will always meet production needs. Other Functions and Parameters 10.1 Mounting speed: 500-1500 UPH 10.2 Flip chip mounting speed: 300-800 UPH 10.3 Tray or pallet feeding: Accommodates up to 32 pcs of 2”x2” waffle packs, 10 pcs of 4”x4” trays or a combination of pallets 10.4 Tape feeding: 8mm, 12mm, 16mm, 24mm, 32mm, 44mm; up to 16 pcs of 8mm feeders can be installed 10.5 Wafer feeding: Supports up to 8-inch wafers (12-inch optional), equipped with motor-driven Z-axis ejector device and die bonding ring, etc. 10.6 Chip size: 0.15-5mm (minimum); nozzle replacement required for different sizes 10.7 Chip thickness: 0.05-2mm for chips or solder pieces 10.8 Vacuum eutectic furnace: Max. temperature up to 500°C; vacuum degree ranges from 10pa to 500pa depending on the optional vacuum pump; the process is controlled by an integrated and mature vacuum eutectic furnace software system 10.9 Computer: Industrial grade industrial personal computer (IPC) with Intel Core i7 processor (main frequency ≥2.0GHz), memory ≥4G, hard disk ≥500G, 2 Gigabit Ethernet ports and two sets of synchronously backed-up hard drives 10.10 Data acquisition card: 16-bit, 16-channel with a sampling rate of 250K 10.11 Dispenser configuration: Equipped with a dispenser; high-precision dispensing is achieved through the cooperation of the dispensing controller with adjustable time, pressure, vacuum suction and dispensing uniformity algorithm 10.12 Industrial cameras: Equipped with more than three sets of industrial cameras 10.13 Worktable: Can hold more than 32 sets of waffle packs 10.14 Observation window: Made of anti-static and fire-resistant PC material 10.15 Program storage and recall: Programmed parameters are stored; automated production is realized by calling the saved programs during operation 10.16 3D automatic calibration software: Supports unlimited version backups of the programmed programs 10.17 Independent mounting pressure setting: Independent mounting pressure can be set for each chip, with closed-loop feedback control of the mounting pressure via software 10.18 Axis speed setting: The movement speeds of X, Y, Z and theta axes under different states (homing speed, self-test speed, mounting speed) and mounting pressure can be set separately via software 10.19 Vacuum nozzle control: On/off of the vacuum nozzle is controllable via software 10.20 Modular design: Designed with a modular structure for easy maintenance; one set of spare parts is provided for vulnerable and key components 10.21 Safety protection: The whole machine is equipped with protective devices to prevent human hands from reaching into the machine during normal operation; emergency stop protection is triggered when the machine cover is opened.
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