High-Temperature Nitrogen Reflow Oven — N300

The N300 is a bench-top offline device suitable for small-batch production, mainly serving laboratories, research institutes and customers with low production capacity requirements. The N300 is designed with an automatic door opening and closing structure plus an added door locking function for easy operation. Its sealing structure is upgraded on the basis of traditional bench-top reflow ovens, delivering better overall sealing performance to meet customers' demands for high-quality soldering. In addition, the N300 is equipped with bottom heating, enabling a higher temperature rise rate and a substantial increase in operating temperature. It is also fitted with two sets of temperature control systems. To ensure the equipment's stability during high-temperature soldering, a ventilation system and a built-in cooling circulation system are additionally incorporated into the device. Key Features of Nitrogen Reflow Soldering A. Nitrogen reflow soldering is the process of filling the reflow oven chamber with nitrogen to block air from entering the oven. This prevents the oxidation of component pins during reflow soldering, as well as the oxidation of solder pads and solder during preheating, soldering or cooling processes. B. Nitrogen reflow soldering is mainly used to enhance soldering quality by performing soldering in an environment with extremely low oxygen content (1000 PPM or even lower), thus avoiding component oxidation. Therefore, the primary requirement for nitrogen reflow soldering is to keep the oxygen content as low as possible. C. In accordance with different customer requirements, Zhongke Tongzhi has developed a variety of nitrogen reflow ovens, including bench-top offline devices, bench-top online devices and vertical online devices. The most representative one is the N300, a bench-top offline device ideal for small-batch production scenarios such as laboratories and research institutes.