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Silver Sintering Die Bonder — DB100A
The DB100A is a manual and semi-automatic silver sintering die bonder. The whole machine adopts a marble motion platform to ensure the overall motion accuracy reaches the submicron level. Equipped with a built-in laser height measurement system, it is suitable for die attach and eutectic soldering of deep cavity substrates. Optional configurations include a nozzle heating module, nozzle pressure feedback system, UV dispensing and curing module, nitrogen protection gas module, substrate preheating module, process monitoring module and chip flip-chip mounting module.
Silver Sintering Die Bonder — DB100
The DB100A is a manual and semi-automatic silver sintering die bonder. The whole machine adopts a marble motion platform to ensure the overall motion accuracy reaches the submicron level. Equipped with a built-in laser height measurement system, it is suitable for die attach and eutectic soldering of deep cavity substrates. Optional configurations include a nozzle heating module, nozzle pressure feedback system, UV dispensing and curing module, nitrogen protection gas module, substrate preheating module, process monitoring module and chip flip-chip mounting module.
High-Precision Silver Sintering Die Bonder — DB160A
The DB160A is a manual and semi-automatic silver sintering die bonder. The whole machine adopts a marble motion platform to ensure the overall motion accuracy reaches the submicron level. Equipped with a built-in laser height measurement system, it is suitable for die attach and eutectic soldering of deep cavity substrates. Optional configurations include a nozzle heating module, nozzle pressure feedback system, UV dispensing and curing module, nitrogen protection gas module, substrate preheating module, process monitoring module and chip flip-chip mounting module.
High-Precision Die Bonder — DB100S
The DB100S is a manual-semi-automatic micro-assembly die mounting system. The whole machine adopts a marble motion platform to ensure the overall motion accuracy reaches the submicron level. Equipped with a built-in laser height measurement system, it is suitable for die attach and eutectic soldering of deep cavity substrates. Optional configurations include a nozzle heating module, nozzle pressure feedback system, UV dispensing and curing module, nitrogen protection gas module, substrate preheating module, process monitoring module and chip flip-chip mounting module.
The mounting accuracy of the system can reach 1μm with different configurations, and the nozzle can be manually replaced for chips of different sizes. It is an essential equipment for high-precision die attach and bonding in high-end medical devices (core imaging module assembly), optical devices (laser LD bar assembly, VCSEL, PD, LENS assembly, etc.) and semiconductor chips (MEMS devices, RF devices, microwave devices an
Submicron Flip Chip Mounter — T8WS (Aerostatic Version Optional)
Suitable for mounting chip components in the post-package process of semiconductor integrated circuit production, enabling dispensing, adhesive dipping, die attach, chip mounting, wafer die attach and flip chip mounting for GaAs devices. The mounting pressure is programmably controllable with high precision.
Adopting a precision magnetic levitation motion platform, the X and Y axes of the main system use a contactless and frictionless magnetic levitation system with high-resolution linear encoders. The encoder scale achieves an accuracy of 0.02μm, enabling high-speed, precise and submicron-level positioning.
