Welding Temperature: The maximum actual welding temperature of the VPO300 vacuum positive pressure sintering furnace is ≥800℃. Vacuum Degree: Ultimate vacuum degree ≤5×10⁻² torr. Positive Pressure Capacity: 0.5Mpa (1Mpa optional). Effective Welding Area: ≥300mm×300mm. Furnace Chamber Inner Diameter/Height: Inner diameter 480mm, height ≥65mm (120mm/220mm height optional). Heating Method: Adopts bottom infrared radiation heating; the hot plate is a silicon carbide platform, which is non-deformable for long-term use and has high thermal conductivity, ensuring more uniform surface temperature of the hot plate. Temperature Uniformity: ≤±1% within the effective welding area. The heating platform is a pure wafer carrying platform without water cooling pipes, achieving higher temperature uniformity. Temperature Rise Rate: Maximum temperature rise rate 120℃/min. Cooling Rate: Maximum cooling rate 120℃/min (range from no-load maximum temperature to 150℃). The silicon carbide heating platform adopts a combined air + water cooling method to realize rapid cooling of the hot plate, increase the cooling rate, and avoid poor device sintering caused by excessive temperature difference during cooling. It meets the welding requirements of various solders (＞800℃), especially the sintering of nano-silver materials under moderate positive pressure. Welding Void Rate: Through a large number of customer verifications, the void rate of VPO300 in soft solder welding can be controlled below 2%. Optional High Positive Pressure Module: The equipment can be equipped with an optional positive pressure module ≤1Mpa, meeting the requirements of positive and negative pressure processes. The positive pressure process can effectively solve the displacement problem of micro devices during welding, improve the metal density of solder, and prevent solder flux splashing. Temperature Control System and Temperature Measurement System 13.1 The VPO300 vacuum positive pressure welding and packaging furnace adopts advanced temperature control technology with a temperature control accuracy of ±1℃. 13.2 The temperature curve of the VPO300 can be set with up to 40 temperature segments and configured with 6 groups of PID settings for more precise temperature control, ensuring welding consistency and reliability. Temperature control is lag control, while PID control has the function of advanced regulation, which can improve temperature control accuracy and stability. 13.3 The furnace chamber of the VPO300 is standard equipped with 2 groups of temperature measuring thermocouples. The equipment can feed back the temperature at any position in the chamber in real time during operation, and the temperature measuring curve is displayed in real time in the control software, which better ensures the temperature control of the welding area and supports the acquisition of an excellent process curve. Furnace Chamber Atmosphere Environment The VPO300 can be filled with inert gas (nitrogen) for auxiliary welding, and simultaneously meets the reducing atmosphere processes of formic acid and hydrogen-nitrogen mixed gas (5% hydrogen + 95% nitrogen). The process atmosphere can be precisely controlled by time or MFC mass flow meter to ensure the consistency of each set process execution, and realize welding without flux. Software Control System Configuration 15.1 The software control system is based on the Windows operating system with simple operation. 15.2 The entire process is automatically controlled by software programming of process conditions such as temperature, time, pressure and vacuum. 15.3 The process curve programming supports an unlimited number of process actions to meet complex process requirements. 15.4 The control system is compatible with various welding process curves (5 preset processes), and supports setting, modification, storage (unlimited quantity in computer) and recall for different processes. 15.5 The control system has a built-in analysis function to analyze process curves and determine information such as temperature rise, constant temperature and temperature drop. 15.6 The software control system automatically records welding processes, temperature control and measurement curves in real time to ensure the traceability of device processes, and the data is automatically stored in the corresponding directory according to the process working time. Adopts a fully automatic closed cavity structure to ensure long-term use reliability. The upper cover will not cause device displacement when closing automatically during use, avoiding the impact of device vibration on welding quality. The single-chamber process meets the requirements of both heating and cooling simultaneously. The upper cover is automatically liftable and rotatable (lifting height ≥10mm, rotation angle ≥150°). Except for manual loading and unloading, all other operations are completed by automatic software control. The height of the worktable is about 880mm±50mm. The heating plate is made of pure material without additional structures such as cold water pipes, ensuring more uniform temperature. The VPO300 adopts the 6th generation water cooling technology of Zhongke Tongzhi. Water cooling does not affect the temperature uniformity of the thermal field during heating; the heating plate and water cooling system are precisely matched to achieve rapid water cooling during cooling with higher temperature uniformity. It is particularly suitable for higher-quality packaging and welding, such as the packaging and welding of silicon carbide (SiC) chips.
English
