Formic/Fluxless Reflow Oven-VF200

MS series vacuum soldering oven, a professional industrial vacuum soldering oven. Why use a vacuum soldering oven? For some soldering fields with high requirements, such as military products and industrial high reliability products, even nitrogen protection reflow oven cannot meet the reliability requirements of the products. The soldering requirements for high reliability circuits in materials testing, chip packaging, power equipment, automotive products, train control, aerospace, aviation systems, etc. must eliminate or reduce the voids and oxidation of soldering materials. How to effectively reduce the void rate and minimize the oxidation of solder pads or component pins, vacuum soldering oven is an ideal choice. To achieve high soldering quality, a vacuum soldering oven must be used. This is the latest process innovation from SMT soldering experts in countries such as Germany, Japan, and the United States. Industry application: The MS series vacuum soldering oven is an ideal choi

The furnace consists of 5 zones: Loading Zone, Preheating Zone, Heating Zone, Cooling Zone and Unloading Zone. It is configured with a double-layer vacuum chamber (internal and external), a distinctive design compared with single-layer vacuum chambers of similar equipment. The double-layer structure ensures zero workpiece oxidation and formic acid leakage prevention, with the oxygen content maintained below 5 ppm.

The furnace consists of 3 independent process chambers for Preheating, Heating and Cooling respectively; each chamber is fitted with a viewing window, and the pressure of the process chamber ranges from 0.2 to 1050 mbar. The furnace supports and enables precise control of nitrogen, formic acid (nitrogen + formic acid) atmospheres, and is compatible with preformed solder foil processes. Programmable multi-stage vacuum pumping function: Each chamber is equipped with an independent vacuum pump and control system, with a vacuum level ≤ 1 mbar and a pumping speed of 100 m³/h. A soft pumping valve is installed for adjustable pumping rate. The vacuum value of the chamber is displayed in real time and can be controlled and adjusted.

The furnace consists of 5 zones: Loading Zone, Preheating Zone, Heating Zone, Cooling Zone and Unloading Zone. It is configured with a double-layer vacuum chamber (internal and external), a distinctive design compared with the single-layer vacuum chambers of similar equipment. This double-layer structure ensures zero workpiece oxidation and formic acid leakage prevention, with the oxygen content maintained below 5 ppm.

The furnace consists of 4 independent process chambers: 2 Preheating Zones, 1 Heating Zone and 1 Cooling Zone; each chamber is fitted with a viewing window, and the pressure of the process chamber ranges from 20 to 200 Pa. The furnace supports and enables precise control of nitrogen, formic acid (nitrogen + formic acid) atmospheres, and is compatible with preformed solder foil processes. Programmable multi-stage vacuum pumping function: Each chamber is equipped with an independent vacuum pump and control system, with a vacuum level ≤ 20 Pa and a pumping speed of 200 m³/h. A soft pumping valve is installed for adjustable pumping rate. The vacuum value of the chamber is displayed in real time and can be controlled and adjusted.