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    Vacuum Formic Acid Oven — V8-200-3
    • Vacuum Formic Acid Oven — V8-200-3

    Vacuum Formic Acid Oven — V8-200-3

    The V8-200-3 Vacuum Formic Acid Reflow Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8-200-3 Vacuum Formic Acid Reflow Oven is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry.

    The V8-200-3 Vacuum Formic Acid Reflow Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8-200-3 Vacuum Formic Acid Reflow Oven is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry. Core Advantages High Output: Up to 120–130 frames per hour (calculated based on the soldering time of each temperature zone). Low Energy Consumption: Total startup power: 18 KW; Average operating power: 6 KW. Low Nitrogen Consumption: Nitrogen consumption is only 1/4–1/5 of that of other similar vacuum oven products. Compact Footprint: Overall dimensions: 3300 × 1000 × 1300 mm. Solder Compatibility Suitable for soldering with various solders (≤450℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste and other solder paste formulations of all compositions. Soldering Void Ratio Pad void ratio: < 2% Single void ratio: 2% Note: Different soldering materials and atmospheres will affect the soldering results. The above data is a comprehensive summary based on customer tests, and specific values may vary for different soldering products. Key Functional Features Supports nitrogen atmosphere working environment to meet the requirements of multiple soldering processes. Equipped with a software control system with modular design and a concise, user-friendly operation interface. No calibration is required for the equipment, eliminating additional calibration costs.


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    MS series vacuum soldering ove...
    The furnace consists of 5 zone...
    The furnace consists of 3 inde...
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    • The V8-200-3 Vacuum Formic Acid Reflow Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. The V8-200-3 Vacuum Formic Acid Reflow Oven is specially optimized and designed for the specific vacuum soldering and packaging requirements of lead frame products, LED products and power devices in the semiconductor industry. It is a carefully engineered vacuum oven developed to address various challenges encountered by customers in the current industry. Core Advantages High Output: Up to 120–130 frames per hour (calculated based on the soldering time of each temperature zone). Low Energy Consumption: Total startup power: 18 KW; Average operating power: 6 KW. Low Nitrogen Consumption: Nitrogen consumption is only 1/4–1/5 of that of other similar vacuum oven products. Compact Footprint: Overall dimensions: 3300 × 1000 × 1300 mm. Solder Compatibility Suitable for soldering with various solders (≤450℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste and other solder paste formulations of all compositions. Soldering Void Ratio Pad void ratio: < 2% Single void ratio: 2% Note: Different soldering materials and atmospheres will affect the soldering results. The above data is a comprehensive summary based on customer tests, and specific values may vary for different soldering products. Key Functional Features Supports nitrogen atmosphere working environment to meet the requirements of multiple soldering processes. Equipped with a software control system with modular design and a concise, user-friendly operation interface. No calibration is required for the equipment, eliminating additional calibration costs.


    MS Series Vacuum Reflow Oven MS440/MS440T

    MS series vacuum soldering oven, a professional industrial vacuum soldering oven. Why use a vacuum soldering oven? For some soldering fields with high requirements, such as military products and industrial high reliability products, even nitrogen protection reflow oven cannot meet the reliability requirements of the products. The soldering requirements for high reliability circuits in materials testing, chip packaging, power equipment, automotive products, train control, aerospace, aviation systems, etc. must eliminate or reduce the voids and oxidation of soldering materials. How to effectively reduce the void rate and minimize the oxidation of solder pads or component pins, vacuum soldering oven is an ideal choice. To achieve high soldering quality, a vacuum soldering oven must be used. This is the latest process innovation from SMT soldering experts in countries such as Germany, Japan, and the United States. Industry application: The MS series vacuum soldering oven is an ideal choi

    Inline Formic Acid High-Vacuum Sintering Furnace — VX410

    The furnace consists of 5 zones: Loading Zone, Preheating Zone, Heating Zone, Cooling Zone and Unloading Zone. It is configured with a double-layer vacuum chamber (internal and external), a distinctive design compared with single-layer vacuum chambers of similar equipment. The double-layer structure ensures zero workpiece oxidation and formic acid leakage prevention, with the oxygen content maintained below 5 ppm.

    Inline Formic Acid Vacuum Sintering Furnace — VF300

    The furnace consists of 3 independent process chambers for Preheating, Heating and Cooling respectively; each chamber is fitted with a viewing window, and the pressure of the process chamber ranges from 0.2 to 1050 mbar. The furnace supports and enables precise control of nitrogen, formic acid (nitrogen + formic acid) atmospheres, and is compatible with preformed solder foil processes. Programmable multi-stage vacuum pumping function: Each chamber is equipped with an independent vacuum pump and control system, with a vacuum level ≤ 1 mbar and a pumping speed of 100 m³/h. A soft pumping valve is installed for adjustable pumping rate. The vacuum value of the chamber is displayed in real time and can be controlled and adjusted.

    Inline Formic Acid High-Vacuum Sintering Furnace — VX610

    The furnace consists of 5 zones: Loading Zone, Preheating Zone, Heating Zone, Cooling Zone and Unloading Zone. It is configured with a double-layer vacuum chamber (internal and external), a distinctive design compared with the single-layer vacuum chambers of similar equipment. This double-layer structure ensures zero workpiece oxidation and formic acid leakage prevention, with the oxygen content maintained below 5 ppm.

    Inline Formic Acid Vacuum Sintering Furnace — VF400

    The furnace consists of 4 independent process chambers: 2 Preheating Zones, 1 Heating Zone and 1 Cooling Zone; each chamber is fitted with a viewing window, and the pressure of the process chamber ranges from 20 to 200 Pa. The furnace supports and enables precise control of nitrogen, formic acid (nitrogen + formic acid) atmospheres, and is compatible with preformed solder foil processes. Programmable multi-stage vacuum pumping function: Each chamber is equipped with an independent vacuum pump and control system, with a vacuum level ≤ 20 Pa and a pumping speed of 200 m³/h. A soft pumping valve is installed for adjustable pumping rate. The vacuum value of the chamber is displayed in real time and can be controlled and adjusted.
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