Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-16

Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s. Vacuum level, vacuum holding time, gas release time, vacuum pumping rate and other parameters can be freely set. Capable of soldering circuit boards equipped with aluminum heat sinks. Environment-friendly design with ultra-low power consumption and high thermal insulation performance, the shell temperature remains below 40℃. Equipped with a high-efficiency and large-capacity flux recovery device. Adopts integrated oxygen sensor technology to ensure precise control of oxygen content, and enables real-time/continuous monitoring of residual oxygen content in the furnace chamber. The equipment can also be used as a conventional nitrogen or air reflow oven.