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    Offline Vacuum Reflow Oven-H3
    • Offline Vacuum Reflow Oven-H3

    Offline Vacuum Reflow Oven-H3

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    1. Soldering area600mm*250mm*3 layer
    2. Temperature rangeMax 450℃
    3. Vacuum≤10Pa
    4. Temperature uniformity±3%
    5. Heating rate≤100℃/Min
    6. Cooling rate≤80℃/Min
    7. Cooling wayWater cooling
    8. Heating plate materialGraphite plate
    9. Weight800Kg
    10. Size1350*1000*1830mm
    11. Power supply380V 25-50A
    常见问题1 2 3
    • Characteristic：

                                               

      1. Soldering area600mm*250mm*3 layer
      2. Temperature rangeMax 450℃
      3. Vacuum≤10Pa
      4. Temperature uniformity±3%
      5. Heating rate≤100℃/Min
      6. Cooling rate≤80℃/Min
      7. Cooling wayWater cooling
      8. Heating plate materialGraphite plate
      9. Weight800Kg
      10. Size1350*1000*1830mm
      11. Power supply380V 25-50A
      Offline Vacuum Reflow Oven-H3

    •                                          

      1. Soldering area600mm*250mm*3 layer
      2. Temperature rangeMax 450℃
      3. Vacuum≤10Pa
      4. Temperature uniformity±3%
      5. Heating rate≤100℃/Min
      6. Cooling rate≤80℃/Min
      7. Cooling wayWater cooling
      8. Heating plate materialGraphite plate
      9. Weight800Kg
      10. Size1350*1000*1830mm
      11. Power supply380V 25-50A
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