MS series vacuum soldering oven Introduction MS series vacuum soldering oven, a professional industrial vacuum soldering oven. Why use a vacuum soldering oven? For some soldering fields with high requirements, such as military products and industrial high reliability products, even nitrogen protection reflow oven cannot meet the reliability requirements of the products. The soldering requirements for high reliability circuits in materials testing, chip packaging, power equipment, automotive products, train control, aerospace, aviation systems, etc. must eliminate or reduce the voids and oxidation of soldering materials. How to effectively reduce the void rate and minimize the oxidation of solder pads or component pins, vacuum soldering oven is an ideal choice. To achieve high soldering quality, a vacuum soldering oven must be used. This is the latest process innovation from SMT soldering experts in countries such as Germany, Japan, and the United States. Industry application The MS series vacuum soldering oven is an ideal choice for R&D, process research and development, and production from low to high capacity. It is the best choice for high-end R&D and production in military enterprises, research institutes, universities, aerospace and other fields. Application areas Mainly used for defect free soldering of chips and substrates, tube shells and cover plates, and producing perfect helpless solder flux soldering, such as IGBT packaging, solder paste process, laser diode packaging process, hybrid integrated circuit packaging, tube shell cover plate packaging, MEMS and vacuum packaging. Vacuum soldering ovens have become essential equipment for military enterprises, aviation, aerospace and other high-end manufacturing in developed countries such as Europe and America, and have been widely used in fields such as chip packaging and electronic soldering. Product features Soldering in a vacuum environment. The maximum vacuum is ≤ 5Pa (Optional molecular pump vacuum can reach 10^-4Pa), working vacuum is 10^-1Pa. Capable of soldering without the need for soldering flux. Industrial computers combined with professional software control achieve a perfect operating experience. A programmable temperature control system with up to 40 segments in the industry, which can set the most perfect process curve. Circulating water cooling technology achieves rapid cooling effect. Two sets of online temperature measurement functions. Accurate measurement of temperature uniformity in the soldering area. The temperature control accuracy is ± 1 °C, and the temperature uniformity within the effective area is ≤ ± 2%. Supports formic acid, nitrogen, and nitrogen hydrogen mixed gas (95% nitrogen, optional) atmosphere working environment to meet various soldering processes. The maximum temperature is 450 °C (higher optional), meeting all the requirements of soft soldering processes. The top cover of the oven chamber is equipped with an observation window. The equipment does not require calibration and will not incur additional calibration costs. Standard configuration 1 set vacuum soldering oven 2 sets of temperature control system 3 sets of temperature measurement system 1 set of vacuum system 1 set of top heating system 1 set of alloy heating platform 1 set of water cooling system (including industrial water chiller) 1 set of nitrogen atmosphere protection system 1 set of formic acid atmosphere system 1 set of vacuum soldering oven control software system 1 industrial computer 2 cooling air pipes (spare parts) 3 heating tubes (spare parts) Optional Corrosion resistant diaphragm pump, vacuum 10mbar Rotary vane pump for vacuum of 10^-3mbar Vortex molecular pump system, used for vacuum of 10^-6mbar Mechanical oil free pump Component fixture 110V power supply system Hydrogen system
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