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    Inline Vacuum Formic Acid Oven — V8N-6
    • Inline Vacuum Formic Acid Oven — V8N-6

    Inline Vacuum Formic Acid Oven — V8N-6

    The V8N Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. It is specially optimized and designed for the vacuum soldering and packaging needs of IGBT modules and MOSFET devices in the power semiconductor industry. This is a carefully engineered vacuum oven developed to address common challenges faced by industry customers.
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    The V8N Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. It is specially optimized and designed for the vacuum soldering and packaging needs of IGBT modules and MOSFET devices in the power semiconductor industry. This is a carefully engineered vacuum oven developed to address common challenges faced by industry customers. Core Advantages High Output: Completes soldering of one batch of IGBT modules every 4–10 minutes. Low Energy Consumption: Total startup power: 66 KW; Average operating power: 10–12 KW. Low Nitrogen Consumption: Nitrogen usage is only 1/2–2/3 that of comparable vacuum ovens. Compact Footprint: Overall dimensions: 4550 × 1200 × 1620 mm. Solder Compatibility Suitable for soldering with various solders (≤400℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste, and other solder paste formulations. Soldering Void Ratio Pad void ratio: < 2% Single void ratio: < 1% Note: Different soldering materials and atmospheres will affect results. These values are based on comprehensive customer testing and may vary by product. Key Functional Features Supports both nitrogen and formic acid atmosphere operation to accommodate multiple soldering processes. Equipped with a software control system featuring a modular design and an intuitive, user-friendly interface. Requires no calibration, eliminating additional calibration costs.

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    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-9

    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-9

    Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s.
    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12

    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12

    Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s.
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    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-16

    Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s.
    Inline Vacuum Reflow Oven — VRO945

    Inline Vacuum Reflow Oven — VRO945

    The VRO945 Inline Vacuum Reflow Oven features high output, low energy consumption and low nitrogen consumption. It is specially optimized and designed for the special vacuum soldering and packaging requirements of lead frame products and CLIP products in the semiconductor industry. A carefully optimized vacuum reflow oven developed in response to various challenges encountered by customers in the current industry.
    Vacuum Formic Acid Oven — V8SL

    Vacuum Formic Acid Oven — V8SL

    The V8SL vacuum formic acid reflow oven features ultra-low vacuum degree, high throughput, low energy consumption, low nitrogen consumption and compact footprint. Specifically optimized and designed for the semiconductor industry, the V8SL is a dedicated vacuum oven for vacuum welding and packaging of lead frame products, LED products and power devices, addressing various pain points currently faced by industry customers.
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    Inline Vacuum Reflow Oven — VRO945
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    • Inline Vacuum Formic Acid Oven — V8N-6

    • The V8N Inline Vacuum Soldering Oven features ultra-low vacuum level, high output, low energy consumption, low nitrogen consumption and compact footprint. It is specially optimized and designed for the vacuum soldering and packaging needs of IGBT modules and MOSFET devices in the power semiconductor industry. This is a carefully engineered vacuum oven developed to address common challenges faced by industry customers. Core Advantages High Output: Completes soldering of one batch of IGBT modules every 4–10 minutes. Low Energy Consumption: Total startup power: 66 KW; Average operating power: 10–12 KW. Low Nitrogen Consumption: Nitrogen usage is only 1/2–2/3 that of comparable vacuum ovens. Compact Footprint: Overall dimensions: 4550 × 1200 × 1620 mm. Solder Compatibility Suitable for soldering with various solders (≤400℃), including: SAC305 solder paste, Sn63Pb37 solder paste, Sn90Sb10 solder paste, In97Ag3 solder paste, In52Sn48 solder paste, and other solder paste formulations. Soldering Void Ratio Pad void ratio: < 2% Single void ratio: < 1% Note: Different soldering materials and atmospheres will affect results. These values are based on comprehensive customer testing and may vary by product. Key Functional Features Supports both nitrogen and formic acid atmosphere operation to accommodate multiple soldering processes. Equipped with a software control system featuring a modular design and an intuitive, user-friendly interface. Requires no calibration, eliminating additional calibration costs.

    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-9

    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-9

    Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s.
    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12

    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-12

    Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s.
    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-16

    Inline Hot Air Vacuum Formic Acid Reflow Oven — VR-16

    Drastically reduces welding bubbles in solder, resulting in a void ratio as low as 1–2%. Enhances the electrical performance of products and the bonding strength of soldered joints, effectively improving the reliability and quality of solder points. Applicable for double-sided PCB soldering, suitable for mass production and continuous production line integration, with an average production cycle controlled at 30–60s.
    Inline Vacuum Reflow Oven — VRO945

    Inline Vacuum Reflow Oven — VRO945

    The VRO945 Inline Vacuum Reflow Oven features high output, low energy consumption and low nitrogen consumption. It is specially optimized and designed for the special vacuum soldering and packaging requirements of lead frame products and CLIP products in the semiconductor industry. A carefully optimized vacuum reflow oven developed in response to various challenges encountered by customers in the current industry.
    Vacuum Formic Acid Oven — V8SL

    Vacuum Formic Acid Oven — V8SL

    The V8SL vacuum formic acid reflow oven features ultra-low vacuum degree, high throughput, low energy consumption, low nitrogen consumption and compact footprint. Specifically optimized and designed for the semiconductor industry, the V8SL is a dedicated vacuum oven for vacuum welding and packaging of lead frame products, LED products and power devices, addressing various pain points currently faced by industry customers.
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