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    Nano Silver Positive Pressure Sintering Furnace — SIN160
    • Nano Silver Positive Pressure Sintering Furnace — SIN160

    Nano Silver Positive Pressure Sintering Furnace — SIN160

    This nano silver positive pressure sintering furnace is primarily based on mechanical pressure curing. For the pressure application unit, a precision hydraulic control system is adopted in this design to achieve high-precision pressure exertion.

    This nano silver positive pressure sintering furnace is primarily based on mechanical pressure curing. For the pressure application unit, a precision hydraulic control system is adopted in this design to achieve high-precision pressure exertion. A vacuum-sealed structure is employed for the overall furnace chamber and structural design. The curing process can be conducted in a vacuum environment or a protective atmosphere filled with two or more inert gases, which improves the product curing quality. The complete equipment consists of the following systems: pressure application system, vacuum system, heating system, temperature control system, cooling system, etc.

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    • This nano silver positive pressure sintering furnace is primarily based on mechanical pressure curing. For the pressure application unit, a precision hydraulic control system is adopted in this design to achieve high-precision pressure exertion. A vacuum-sealed structure is employed for the overall furnace chamber and structural design. The curing process can be conducted in a vacuum environment or a protective atmosphere filled with two or more inert gases, which improves the product curing quality. The complete equipment consists of the following systems: pressure application system, vacuum system, heating system, temperature control system, cooling system, etc.

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    The DB80H Series is a high-precision die bonder. The whole machine adopts a precision motion platform to ensure the overall motion accuracy meets the mounting precision requirements. A nozzle pressure feedback system is optional to realize pressure mounting; a nozzle heating system is optional to realize eutectic mounting; and a dispensing system is optional to realize dispensing mounting. The mounting accuracy of the system can reach up to 5μm with different configurations, and the nozzle can be manually replaced for chips of different sizes. It is an essential equipment for high-precision die attach and bonding in high-end medical devices (core imaging module assembly), optical devices (laser LD bar assembly, VCSEL, PD, LENS assembly, etc.) and semiconductor chips (MEMS devices, RF devices, microwave devices and hybrid circuits).

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