RS Series Hydrogen Vacuum Reflow Soldering Machine — RS220

The RS Series Hydrogen Vacuum Reflow Soldering Machine is the third-generation compact vacuum reflow soldering equipment launched by Tongzhi Technology. Exclusively designed for small-batch production, R&D design, functional material testing and other applications, it adopts heating in a vacuum environment to achieve void-free solder joints, fully meeting the testing and small-batch production requirements of R&D departments. 

The RS Series can reduce the void ratio in the soldering area of welded devices to 2%, in sharp contrast to the 20%–30% void ratio of conventional reflow soldering machines. It supports flux-free soldering for void-free joints and is compatible with various atmospheric applications using different gases (N₂, N₂/H₂ 95%/5% mixture). The system is adaptable to lead-free solder paste or solder sheet processes, as well as fluxless soldering techniques. Equipped with a user-friendly software control system, it enables direct equipment operation and flexible setting, modification and creation of various soldering profiles tailored to different process requirements. The RS Series is primarily engineered for high-reliability soldering applications where even nitrogen-protected or vapor phase soldering fails to meet stringent reliability standards, such as military products and industrial-grade high-reliability components. It is the ideal solution for scenarios demanding high circuit soldering reliability—including material testing, chip packaging, power equipment, automotive products, train control, and aerospace and aviation systems—where eliminating or minimizing voids and oxidation in soldering materials is a critical requirement. Vacuum reflow soldering, a technological innovation pioneered by welding experts in the military fields of Germany, Japan, the United States and other countries, is an indispensable choice for achieving superior soldering quality. Industrial Applications The RS Series is an ideal choice for R&D, process development, material testing and device packaging trials, and a preferred solution for high-end R&D and production in military enterprises, research institutes, universities, aerospace and other sectors. Application Fields It is mainly used for defect-free welding and high-quality fluxless soldering of chip-substrate and package-lid assemblies, including IGBT packaging, solder paste processes, laser diode packaging, hybrid integrated circuit packaging, package-lid sealing, MEMS packaging and vacuum packaging. Vacuum reflow soldering has now become a must-have piece of equipment for high-end manufacturing in the military, aerospace and aviation industries of developed countries such as Europe and the United States, and is widely applied in chip packaging, electronic soldering and other fields.

Welding in a true vacuum environment with a vacuum level of up to 10⁻³ mbar (10⁻⁶ mbar optional). Optimized for soldering environments with low-activity flux. Professional software control for an optimal operating experience. Industry-leading 40-segment programmable temperature control system for creating tailored optimal soldering profiles. Adjustable temperature settings to develop precise processes that closely match the thermal profiles of soldering materials. Integrated water cooling technology for rapid cooling effect (standard configuration). In-line temperature measurement function enables precise testing of temperature uniformity in the welding area, providing expert-level support for process tuning. Compatible with nitrogen and other inert gases to meet the requirements of special soldering processes. Maximum temperature of 450℃ (higher temperature optional), satisfying all soft soldering process requirements. Supports simultaneous heating of the upper and lower heating chambers. Standard Configuration Main unit × 1 Industrial-grade control computer × 1 Temperature control software × 1 set Temperature controller × 1 set Pressure controller × 1 set Inert gas/nitrogen control valve × 1 set Optional Configuration Corrosion-resistant diaphragm pump (vacuum level: 10 mbar) Rotary vane pump (for 10⁻³ mbar vacuum) Turbomolecular pump system (for 10⁻⁶ mbar vacuum) High-temperature module (max. temperature: 500℃)