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    Hot Cold Separated Vacuum Soldering Oven-V5D
    • Hot Cold Separated Vacuum Soldering Oven-V5D

    Hot Cold Separated Vacuum Soldering Oven-V5D

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    1. Soldering area500mm×350mm
    2. Temperature rangeMax 450℃, higher is optional
    3. Vacuum5Pa with mechnical pump, 10-3Pa with molecular pump
    4. Temperature uniformity±2%
    5. Heating rate≤180℃/min
    6. Cooling rate≤120℃/min
    7. Cooling wayWater cooling + nitrogen cooling
    8. Heating plate materialSilicon carbide coated Graphite plate
    9. Weight650KG
    10. Size1200*1000*1950mm
    11. Power supply380V,25-50A
    常见问题1 2 3
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    Thermal Separation Vacuum Eutectic Furnace — V3D

    Thermal Separation Vacuum Eutectic Furnace — V3D

    Soldering Temperature Maximum actual soldering temperature of the V3D Thermal Separation Vacuum Eutectic Furnace ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 0.2 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 300 mm × 300 mm Furnace Chamber Height 100 mm
    Thermal Separation Vacuum Eutectic Furnace — V4D

    Thermal Separation Vacuum Eutectic Furnace — V4D

    Soldering Temperature Maximum actual soldering temperature ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 380 mm × 310 mm Furnace Chamber Height 100 mm
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    Thermal Separation Vacuum Eutectic Furnace — V3D
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    Thermal Separation Vacuum Eutectic Furnace — V4D
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    • Characteristic：

                                               

      1. Soldering area500mm×350mm
      2. Temperature rangeMax 450℃, higher is optional
      3. Vacuum5Pa with mechnical pump, 10-3Pa with molecular pump
      4. Temperature uniformity±2%
      5. Heating rate≤180℃/min
      6. Cooling rate≤120℃/min
      7. Cooling wayWater cooling + nitrogen cooling
      8. Heating plate materialSilicon carbide coated Graphite plate
      9. Weight650KG
      10. Size1200*1000*1950mm
      11. Power supply380V,25-50A
      Hot Cold Separated Vacuum Soldering Oven-V5D

    •                                          

      1. Soldering area500mm×350mm
      2. Temperature rangeMax 450℃, higher is optional
      3. Vacuum5Pa with mechnical pump, 10-3Pa with molecular pump
      4. Temperature uniformity±2%
      5. Heating rate≤180℃/min
      6. Cooling rate≤120℃/min
      7. Cooling wayWater cooling + nitrogen cooling
      8. Heating plate materialSilicon carbide coated Graphite plate
      9. Weight650KG
      10. Size1200*1000*1950mm
      11. Power supply380V,25-50A
    Thermal Separation Vacuum Eutectic Furnace — V3D

    Thermal Separation Vacuum Eutectic Furnace — V3D

    Soldering Temperature Maximum actual soldering temperature of the V3D Thermal Separation Vacuum Eutectic Furnace ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 0.2 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 300 mm × 300 mm Furnace Chamber Height 100 mm
    Thermal Separation Vacuum Eutectic Furnace — V4D

    Thermal Separation Vacuum Eutectic Furnace — V4D

    Soldering Temperature Maximum actual soldering temperature ≤ 600℃ Vacuum Level Ultimate vacuum ≤ 10 Pa; Working vacuum: 50 Pa – 200 Pa Effective Soldering Area ≤ 380 mm × 310 mm Furnace Chamber Height 100 mm
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