Soldering Temperature Maximum actual soldering temperature of the HV3-3 Vacuum Eutectic Furnace ≥ 500℃ Vacuum Level Ultimate vacuum ≤ 10⁻⁵ Pa; Working vacuum: 10⁻⁵ Pa Effective Soldering Area ≥ 300 mm × 300 mm Furnace Chamber Height ≥ 100 mm, customizable for special height requirements Heating Method Adopts bottom + top infrared radiation heating. The heating plate features a semiconductor-grade silicon carbide graphite platform, which is resistant to deformation during long-term use and boasts high thermal conductivity, ensuring a more uniform surface temperature of the heating plate. Temperature Uniformity ≤ ±2% within the effective soldering area Temperature Rise Rate Maximum temperature rise rate of the graphite heating platform ≤ 120℃/min The HV3-3 is equipped with upper heating, which not only improves heating efficiency but also ensures a more uniform platform temperature to enhance soldering consistency and quality, with a controllable temperature rise rate. Cooling Rate Maximum cooling rate: 60–120℃/min (slope for cooling 100℃ from the no-load maximum temperature) Graphite Heating Platform Adopts a combined air-water cooling method to achieve rapid cooling of the heating plate and increase the cooling rate, while preventing poor device sintering caused by excessive temperature difference during cooling. The cooling rate is process-controllable and can also meet slow cooling requirements. Solder & Material Compatibility Suitable for soldering materials with a temperature requirement of ≤ 500℃, including preformed solder foils such as In97Ag3, In52Sn48, Au80Sn20, SAC305, Sn90Sb10, Sn63Pb37 and Sn62Pb36Ag2 (enabling flux-free eutectic soldering), solder pastes of all compositions, and curing of materials below 500℃. Soldering Void Ratio Validated by numerous customers, the furnace can control the void ratio between 0–3% for soft solder soldering. Temperature Control & Measurement System 11.1 Adopts the temperature control technology of Zhongke Tongzhi with a control accuracy of ±1℃. 11.2 Allows setting of up to 40 temperature segments for the temperature profile and is configured with 6 groups of PID settings for more precise temperature control, ensuring soldering consistency and reliability. Temperature control is a lagging control, while PID control features predictive regulation to improve control accuracy and stability. 11.3 The furnace chamber is standard-equipped with 4 sets of temperature-measuring thermocouples. During operation, the thermocouples can real-time feed back the temperature at any position in the chamber, and the temperature measurement curve is displayed in real time on the control software. This ensures better temperature control of the soldering area and provides support for formulating an optimal process profile. Furnace Chamber Atmosphere The furnace can be filled with nitrogen (an inert gas) for auxiliary soldering and also supports the formic acid reductive atmosphere process. The process atmosphere can be precisely controlled by time or MFC (Mass Flow Controller) to ensure the consistency of each set process execution. The furnace is built-in with a sealed waste gas exhaust channel and filtration system for waste gas treatment and discharge to ensure stable equipment operation, and it supports flux-free soldering. Software Control System Based on the Windows operating system with simple and intuitive operation. Supports process programming by setting process parameters including temperature, time, pressure and vacuum; the software automatically controls the entire soldering process. Allows an unlimited number of process actions in process profile programming to meet complex process requirements. Supports the setting, modification, storage and retrieval of various soldering process profiles for different processes. Built-in analysis function that can analyze process profiles and identify key information such as temperature rise, constant temperature and cooling stages. Automatically records the soldering process and temperature control/measurement curves in real time to ensure the process traceability of devices; all data is automatically saved in the corresponding directory according to the process operation time. Structural Features Adopts a closed chamber structure to ensure reliable long-term use. The upper cover can be closed without causing device displacement, avoiding the impact of device vibration on soldering quality. The single-chamber design supports both heating and cooling processes. The upper cover is equipped with a viewing window for observing the device sintering process via a CCD camera or microscope. The upper cover is automatically lifted and lowered; all operations except manual loading and unloading are completed by automatic software control.
English
