The NS Series Vacuum Reflow Soldering Machine is the third-generation compact vacuum reflow soldering equipment launched by Zhongke Tongzhi. Exclusively engineered for small-batch production, R&D design, functional material testing and other applications, it adopts heating in a vacuum environment to achieve void-free solder joints, fully meeting the testing and small-batch production requirements of R&D departments. The NS Series can reduce the void ratio in the soldering area of welded devices to 2%, in sharp contrast to the 20%–30% void ratio of conventional reflow soldering machines. It supports flux-free soldering for void-free joints and is compatible with various atmospheric applications using different gases (N₂, N₂/H₂ 95%/5% mixture). The system is adaptable to lead-free solder paste or solder sheet processes, as well as fluxless soldering techniques. Equipped with a user-friendly software control system, it enables direct equipment operation and flexible setting, modification and creation of various soldering profiles tailored to different process requirements. The NS Series is primarily designed for high-reliability soldering applications where even nitrogen-protected or vapor phase soldering fails to meet the stringent reliability standards, such as military products and industrial-grade high-reliability components. It is the ideal solution for scenarios demanding high circuit soldering reliability—including material testing, chip packaging, power equipment, automotive products, train control, and aerospace and aviation systems—where eliminating or minimizing voids and oxidation in soldering materials is a critical requirement. Vacuum reflow soldering, a technological innovation pioneered by welding experts in the military fields of Germany, Japan, the United States and other countries, is an indispensable choice for achieving superior soldering quality. Industrial Applications The NS Series is an ideal choice for R&D, process development, material testing and device packaging trials, and a preferred solution for high-end R&D and production in military enterprises, research institutes, universities, aerospace and other sectors. Application Fields It is mainly used for defect-free welding and high-quality fluxless soldering of chip-substrate and package-lid assemblies, including IGBT packaging, solder paste processes, laser diode packaging, hybrid integrated circuit packaging, package-lid sealing, MEMS packaging and vacuum packaging. Vacuum reflow soldering has now become a must-have piece of equipment for high-end manufacturing in the military, aerospace and aviation industries of developed countries such as Europe and the United States, and is widely applied in chip packaging, electronic soldering and other fields. Core Technical Advantages Welding in a true vacuum environment with a vacuum level of up to 6×10⁻¹ Pa. Pressure holding performance: The chamber vacuum can be maintained below 30 Pa within 30 minutes (tested after pumping down to 5 Pa and closing the valve); suitable for soldering with low-activity flux. Professional software control for an optimal operating experience. Industry-leading 40-segment programmable temperature control system for creating optimal soldering profiles. Adjustable temperature settings to develop ideal processes that closely match the thermal profiles of soldering materials. Integrated cooling technology for rapid cooling effect (standard configuration). In-line temperature measurement function for precise measurement of temperature uniformity in the welding area, providing expert-level support for process tuning. Compatible with nitrogen or other inert gases to meet the requirements of special soldering processes. Maximum temperature of 450℃ (higher temperatures optional), meeting the requirements of all soft soldering processes. Supports simultaneous heating of the upper and lower heating chambers. Structural & Design Features Door Locking Method: Automatic program-controlled retractable door locking. Heating Tube Installation: The bottom and top heating tubes are installed at a 90° angle to ensure temperature uniformity, especially at the four edges of the heating plate. Each heating tube is fitted with a quartz sleeve as standard; replacement of heating tubes is convenient and fast without breaking the furnace chamber's vacuum seal. Specially designed brackets fix the heating tubes in the center of the quartz sleeves, effectively extending the service life of the quartz sleeves. The back of each heating tube is coated with a high-temperature layer to improve heat utilization efficiency. The vacuum furnace chamber is CNC integrally machined to reduce the risk of welding defects such as incomplete welding, ensuring vacuum stability for more than 10 years. The automatic locking device of the vacuum door is CNC integrally machined to effectively improve the stability of micro-positive pressure for long-term use. The cooling piping of the vacuum chamber is CNC integrally machined to eliminate the risk of water leakage caused by welding of cooling pipes in the vacuum chamber. The vacuum chamber is made of special materials and developed based on 12 years of vacuum design and process experience, ensuring a vacuum level of 7×10⁻¹ Pa when equipped with a vacuum oil pump and 2 Pa when equipped with a dry vacuum pump. 
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